Circuit Solutions Adds Selective Wave Soldering Capability
May 18, 2018 | Circuit Solutions (Cambridge) LtdEstimated reading time: 1 minute
UK-based contract electronics manufacturer (CEM) Circuit Solutions Ltd (CSL) has invested in a new Ersa Versaflow 3/45 selective wave soldering machine.
Circuit Solutions provides contract manufacturing services to the higher technology end of the electronics industry, with increasing numbers of clients requiring IPC 610 Class 3 standards of soldering on assemblies with multilayer PCBs. The Ersa Versaflow 3/45 provides CSL with the capability to provide the minimum 75% barrel fill soldering required for IPC 610 Class 3—even on multilayer boards with heavy copper inner layers that would be impossible to achieve by conventional wave or hand soldering.
Paul Edmondson, CSL’s Manufacturing Engineering Manager, trialed a particularly challenging multilayer mixed technology assembly, with through-hole pins very close to previously fitted SMT components, over several different manufacturers machines before deciding on the Ersa product. Now several months on from the initial installation, Edmondson comments, "We have been extremely impressed with the capability of the Versaflow, and it has given Circuit Solutions the extra dimension we need to operate in a highly competitive market sector. In addition, the cosmetic appearance of the finished products is also much improved—which is important for a number of our clients."
CSL ordered a two solder-module version of the Versaflow proving them with the optimum mix of throughput, accuracy and flexibility, and are now looking to add a second selective wave soldering machine later in the year.
About Circuit Solutions (Cambridge) Ltd
Circuit Solutions (Cambridge) Ltd is a UK based contract electronics manufacturer specializing in complex small footprint surface mount assembly in small to medium production volumes. CSL also provides hand assembly, full functional test & calibration and box-build services. Founded in 1987, CSL is ISO9001:2015 certified and manufactures assemblies to IPC610 classes 2 & 3, with IPC J-Standard trained assembly staff.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.