NASA Technology Managers Visit TopLine at Space Tech Expo
May 29, 2018 | TopLineEstimated reading time: 1 minute
Members of the NASA Technology Licensing and Commercialization Team visited the TopLine exhibit at the recent 2018 Space Tech Expo show in Pasadena, California, USA, where they awarded a NASA lapel pin to TopLine CEO Martin Hart in appreciation of TopLine’s efforts to develop a business model around PID (Particle Impact Damper) technology. PID cancels random vibrations in PCB printed circuit board assemblies, reducing the potential for damage in harsh environments and is especially suited to applications in the mil-aero defense industry.
TopLine’s innovative PID vibration cancellation particle damping technology was originally developed by NASA, which entered into a License Transfer agreement in 2016 with TopLine to manufacture and commercialize the PID patent. TopLine’s PID were invented at NASA’s Marshall Space Flight Center.
“PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field,” states Martin Hart. “After hardening, old hardware is ready for new missions in new operating environments.” The PID surface mounts onto the PC Board. Inside the PID is a payload of freely-moving tungsten balls that move in the opposite direction to the board. This counter motion pulls back the bending of the board and attenuates vibrational energy. PID technology operates over a full range of temperatures without de-rating. PIDs can be attached like ordinary components. Readers are encouraged to visit a new web site showing a two-minute YouTube video how the PID works. Please click here.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.