Ventec to Demo Latest PCB Material Innovations at JPCA
May 31, 2018 | VentecEstimated reading time: 2 minutes
Ventec International Group Co., Ltd. will showcase its latest PCB material technology innovations at the JPCA show, which is taking place at the Tokyo Big Sight East Hall from June 6-8 in Japan. The Ventec technology team will be on hand on booth #7B-32 showcasing unique laminate & prepreg capability solutions including the latest tec-speed 20.0 material – a Dk 3.48 ceramic-filled hydrocarbon thermoset material designed for high frequency applications.
Didier Mauve (Global Account Manager OEM Technology), Bill Wang (Technical & Quality Director) and Will Zhang (Staff Engineer) will be at JPCA to demonstrate the company’s firm commitment to the Japanese market and further strengthen its position as a global leader in technology for high performance thermal management and signal integrity materials.
Show highlights will include:
tec-speed 20.0
tec-speed 20.0 (VT-870) combines unrivaled high frequency performance (Dk 3.48 / Df 0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network. tec-speed 20.0 is designed for the world's most demanding high-frequency PCB applications such as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.
VT-5A2
VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 minutes, T288 >30 minutes and T300 >15 minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfills RoHS and WEEE requirements and complies with UL94 V0.
VT-4B Series IMS
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming. The tiny minimum radius eases fitting in tight spaces, for an elegantly engineered assembly. The extremely flexible dielectric will not crack or peel. Thermal conductivity 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance. 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications: LED lighting, high power-density converters, power supplies, automotive lighting and controls. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.
VT-901 (IPC QPL Listed)
Where mechanical strength and high-temperature stability are critical, VT-901 polyimide substrate has high flex strength, high glass temperature (Tg), low z-axis CTE, and long T260 and T288 times – to maintain dimensional stability and integrity even under harsh loads. VT-901 is a safe non-MDA formula, with low outgassing tested and approved by NASA, available as laminate or prepreg. Ventec’s proprietary resin system is produced entirely in-house, giving ultimate supply-chain security and quality assurance. Outstanding electrical performance offers high resistivity for electrical isolation, and resistance to arcing, tracking, and dielectric breakdown. Low dielectric constant (Dk) and dissipation factor (Df) ensure excellent signal integrity for computing and communications.
All these and more can be seen at the Ventec JPCA booth #7B-32.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou, China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.