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Last Days to Comment on Automotive Addendum IPC-6012DA
June 1, 2018 | ElmaticaEstimated reading time: 1 minute
The deadline for comments to the Final Draft for Industry Review of IPC-6012DA with Amendment 1, Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, is fast approaching.
Jan Pedersen, senior technical advisor at Elmatica AS and the chair of the task group developing the standard, is urging the industry to take a final look before the final result goes for the ballot.
“The idea behind the automotive addendum was to find a consensus in the jungle of corporate specifications, a common document describing basic PCB requirements for the automotive industry. IPC-6012DA was published in April 2016, the work with the Amendment started in April 2017. A year later, we have made some important changes that will impact the automotive industry,” says Pedersen.
Pedersen believes the Amendment will bring the automotive requirements for both users and suppliers up to an even more standardized level. Next week at the IPC Reliability Forum in Nuremberg, the addendum will be presented full scale.
“I am very excited to present the addendum. The changes of the revised version are of substantial character. Some of the features the Addendum addresses are, among others, cleanliness, solder mask thickness, and wicking. However, that is next week; there is still time for the industry or anyone interested to review and comment. The deadline for commenting is Monday, June 4,” says Pedersen. “We have now managed to have Tier 1 companies join the task group, but above all, they are using the standard. We are on our way from a myriad of automotive corporate standards to one document that describes a consensus on the most important terms and requirements. From the early start, we had some challenges getting attention from the automotive industry, where you generally find huge global players with their own rules and requirements.”
“I would like to address a special thanks to Jan Pedersen for leading the D-33aa Task Group during the development of the Amendment to the IPC-6012DA. The IPC D-33aa Task Group will begin addressing comments on Tuesday, June 5, 2018 at the IPC Automotive Electronics Reliability Forum in Nuremberg, Germany, and will continue through subsequent task group web conferences,” says John Perry, Director, Printed Board Standards & Technology at IPC.
The deadline for comments to the IPC-6012DA with Amendment 1 is Monday, June 4, 2018, via the following IPC KAVI Public Documents Link: https://ipc.kavi.com/kws/public/documents?view=.
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10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.