Modeling an SMT Line to Improve Throughput
June 6, 2018 | Gregory Vance, Rockwell Automation Inc., and Todd Vick, Universal Instruments Corp.Estimated reading time: 5 minutes
Table 2. Sample range of placements per panel versus count of assemblies and forecasted panel volumes.
The idea of using simple regression to develop a model of “placements per panel” to CPH began to develop. This relationship was first studied using production history.
Machine Mathematical Model for CPH
A report was available that contained panels built and total time to build a work order. This report was used to calculate the average CPH per panel for an SMT machine model. A scatter plot with a smoother line was used to view the relationship between the variables for a machine model. The smoother line is a line fitted to the data to explore the potential relationships between two variables, without fitting a specific model, such as a regression line.
There is a relationship between “placements per panel” and CPH but there are points that do not follow the smoother curve. The other observation is that actual CPH values vary greatly compared to the specification value the manufacturer stated.
Since production data was used to model this relationship, all the problem areas outlined earlier represent part of the performance and added noise in the model. Another idea was to use generic product simulation data from the manufacturer. The product simulation information included:
1. Quantity of placements per panel
2. Simulated cycle time for a SMT machine
3. CPH (calculated)
This would filter out the noise from production and machine configuration issues and could then be used to establish a realistic CPH equation. With the simulated cycle time data, the relationship between “placements per panel” and CPH was then studied.
The scatter plot revealed a relationship between “placements per panel” and CPH. Using the Pearson Correlation Coefficient, the strength of the relationship is assessed. At 0.536 it is considered moderate and P-Value of 0.000 means the relationship is statistically significant. This indicates that “placements per panel” is a good predictor of CPH.
To read the full version of this article, which appeared in the May 2018 issue of SMT007 Magazine, click here.
Page 2 of 2Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.