Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Candor is Breaking Boundaries with Flex-Core Boards
June 11, 2018 | Candor IndustriesEstimated reading time: 1 minute
Candor Industries has successfully manufactured 0.5-mil flex-core boards with 0.5-oz copper and 4-mil plated vias.
Sunny Patel, Candor’s technical sales manager, remarked about the accomplishment, "We are pushing the limits on our flex manufacturing, going for much thinner substrates and different material stiffeners."
Thinner material processing allows for better real estate savings for Candor’s flex customers when fitting into smaller packaging. By working together with Candor, developing these types of prototypes will allow for faster lead times with better cost savings down the road.
"Customers need hard, but thin, materials in thin core applications. We’ve found that stainless steel is a good fit for this and we can easily provide this service in-house using our unique flex processing,” said Patel.
Conventional board shops may have trouble getting tooling holes in stainless without CNC subcontracting. Due to their continual investments in the needs of their customers, Candor is able to provide detailed cutting of stainless sheets in-house.
About Candor Industries
Since 1999, Candor Industries has provided 21st Century customers with innovative PCB solutions for complex technologies through a commitment to service and support. Limitations created by standard manufacturing methods led Candor to invent and develop certain technological advancements, helping them to emerge in the forefront as a top of the line solutions provider. Candor continues to push the envelope of PCB manufacturing through continuous R&D, helping both customers and the industry to a brighter future. For more information about Candor, click here.
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.