IAR Systems Enables Powerful IoT Security Applications Based on Groundbreaking MCUs from Microchip
June 25, 2018 | PRNewswireEstimated reading time: 1 minute
IAR Systems announces tools support for the new SAM L10 and SAM L11 microcontroller families available from Microchip Technology Inc. Using the leading development toolchain IAR Embedded Workbench for Arm companies can maximize the performance of the microcontrollers and streamline their development workflow.
The SAM L10 and SAM L11 families are based on the Arm Cortex-M23 core and SAM L11 features extensive security features such as secure boot, secure key storage and an on-board cryptographic module, protecting customers' IP and data. In addition to extensive security features, the microcontrollers offer very low power consumption, making them a perfect fit for implementing secure IoT nodes. These microcontrollers also integrate enhanced Peripheral Touch Controller (PTC) to deliver best-in-class water tolerant and noise immune, elegant touch interfaces. By using IAR Embedded Workbench for Arm for the application development, companies can leverage advanced code optimization techniques and power debugging functionality to make sure the application is fast, efficient and highly compact.
"Low power and high security are key enablers for IoT implementations," says Rod Drake, vice president of Microchip's MCU32 business unit. "Together, with IAR Systems, we are providing our customers with new possibilities for planning for security from the start and ensuring that the applications provide best-in-class energy efficiency. Our new microcontrollers and tools from IAR Systems enable a myriad of automotive, appliance, medical and consumer applications."
"By making use of our highly optimizing tools, developers can fully leverage the performance and power saving features of the SAM L10 and SAM L11 microcontrollers," says Anders Lundgren, Product Manager, IAR Systems. "Thanks to the smart functionality and powerful debugging technology that IAR Embedded Workbench offers, they will also be able to speed up their development and bring their IoT products faster and easier to market."
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.