5GIC Shows Digital Minister a Vision of the Future
June 29, 2018 | University of SurreyEstimated reading time: 1 minute

The purpose of the visit was to learn more about how 5GIC is helping the UK take the lead in the global 5G race. In particular, the Minister was keen to understand the differences between 4G and 5G – especially use cases where only 5G can support.
The Minister had the opportunity to see hands-on demonstrations of 5G technology and the potential it has to transform homes and cities by using artificial intelligence, improve the way care providers monitor conditions such as dementia and how 5G can take the virtual reality experience to another level. The Minister also saw demonstrations of 5G-controlled wireless robots with high reliability and low latency of less than 2 milliseconds, along with examples of drones for people safety and security.
Margot James, Minister for Digital and the Creative Industries, said: "The 5G Innovation Centre is playing a key role to help ensure the UK is fit for a 5G future. It’s been truly inspiring to be shown around this hotbed of 5G activity and see first-hand some of the amazing benefits that 5G will deliver for the economy and wider society."
Regius Professor Rahim Tafazolli, Director and Founder of the 5GIC at the University of Surrey, said: “We were pleased to welcome the Minister, who has been a strong and consistent voice of support for our Centre. We had the opportunity to show the Minister the progress we have made with our 5G network technology and discuss how these innovative and industry leading projects could be the foundation for the country’s success for years to come.”
The University of Surrey is also working closely with three projects from the Government’s £25m 5G Testbeds and Trials Programme, which aims to cement the UK’s position as a world leader in the development of 5G technology.
The testbeds focus on delivering real-world benefits from 5G technology in important sectors of the UK economy. This includes improving connectivity for rural communities; increasing industrial productivity using robotics, big data analytics and Augmented Reality (AR); and the development of Connected and Autonomous Vehicles (CAVs).
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.