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Advanced Electronics Packaging Digest

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Apprenticeship Summit Highlights Electronics Workforce ‘Puzzle’

05/27/2026 | Victoria Hawkins, Global Electronics Association
Last week, I had the opportunity to attend the 2026 Apprenticeships for America Summit in Washington, D.C., and it was both energizing and informative to be surrounded by so many leaders working to strengthen and scale apprenticeships across the country. The summit brought together employers, intermediaries, workforce leaders, educators, policy experts, and apprenticeship advocates to discuss some of the most important topics in our field

BAE Systems Announces Facility Upgrades to Enhance U.S. Military Readiness

05/25/2026 | BAE Systems
BAE Systems announced a $135 million investment for facility enhancements in Austin, Texas and Hudson, New Hampshire, further strengthening the U.S. defense industrial base.

Tata Electronics, ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India

05/21/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and ASML, one of the world’s leading semiconductor equipment manufacturing companies, announced the signing of a Memorandum of Understanding (MoU) to advance the semiconductor manufacturing ecosystem in India.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).

Fraunhofer IPMS Develops Wafer-Level High-Density Chiplet Systems

05/20/2026 | Fraunhofer IPMS
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method that allows different chip components to be fused almost seamlessly into a single unit.
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