Semiconductor Equipment Market to Reach $62.7 Billion in 2018
July 9, 2018 | SEMIEstimated reading time: 1 minute
Releasing its mid-year forecast at the annual SEMICON West exposition, SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 10.8% to $62.7 billion in 2018, exceeding the historic high of $56.6 billion set last year. Another record-breaking year for the equipment market is expected in 2019, with 7.7% forecast growth to $67.6 billion.
The SEMI Mid-Year Forecast predicts wafer processing equipment will rise 11.7% in 2018 to $50.8 billion. The other front-end segment, consisting of fab facilities equipment, wafer manufacturing, and mask/reticle equipment, is expected to jump 12.3% to $2.8 billion this year. The assembly and packaging equipment segment is projected to grow 8.0% to $4.2 billion in 2018, while semiconductor test equipment is forecast to increase 3.5% to $4.9 billion this year.
In 2018, South Korea will remain the largest equipment market for the second year in a row. China will rise in the rankings to claim the second spot for the first time, dislodging Taiwan, which will fall to the third position. All regions tracked except Taiwan will experience growth. China will lead in growth with 43.5%, followed by Rest of World (primarily Southeast Asia) at 19.3%, Japan at 32.1%, Europe at 11.6%, North America at 3.8% and South Korea at 0.1%.
SEMI forecasts that, in 2019, equipment sales in China will surge 46.6% to $17.3 billion. In 2019, China, South Korea, and Taiwan are forecast to remain the top three markets, with China rising to the top. South Korea is forecast to become the second largest market at $16.3 billion, while Taiwan is expected to reach $12.3 billion in equipment sales.
About SEMI
SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
09/04/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfMost of what we hear about Apple’s relationship with China is half-baked punditry or political noise. However, Patrick McGee’s "Apple in China: The Capture of the World’s Greatest Company" is a tour de force that peels back the PR polish and shows us what’s really going on behind that gleaming bitten fruit.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
China’s Rare Earth Exports to US Surge 660% After Trade Agreement
07/23/2025 | I-Connect007 Editorial TeamRare earth element exports from China to the U.S. rose by 660% monthly, according to information released by Beijing’s General Administration of Customs, MSN reported.