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MacDermid Enthone to Present at Advances in Thermal Management Conference
July 15, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will present at the Advances in Thermal Management Conference which will take place at the Hyatt Regency Denver Tech Center, Denver, Colorado August 8-9, 2018. The conference gathers organizations in the electronics industry supply chain that depend on the precise dissipation of heat in electronic devices.
The presentation, “Understanding Thermal Demands for PCB Design and Developments in Fabrication," will be delivered by Rich Bellemare, Global Applications Manager, Metallization, on Thursday, August 9 at 10 am.
Lenora Clark, Director of OEM Applications, who co-authored the paper with Bellemare and Bill Bowerman, Director of Metallization, said, “New functional demands in the automotive industry are forcing change in the design and fabrication of PCB’s. These changes affect electrical performance and heat management. This paper explains how a unique electroplating method can increase the PCB’s ability to manage heat and increase the life of the product.“
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.
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