-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Unveils Self-Programming 3D Inspection Software
August 14, 2018 | Saki CorporationEstimated reading time: 3 minutes
Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
Saki Self-Programming is a seamless system that doesn't require DFM software. It combines technology that captures complete height and XY data and images while simultaneously scanning multiple fields of view. The ability to select from over 300,000 components from Saki's Golden Library offers unlimited possibilities. In a matter of minutes, with just a few clicks, SPI/AOI inspection data can be programmed automatically, using a defined set of standards and criteria, such as naming, orientation, and parameters, as those recognized by IPC standards for AOI and SPI systems. This removes the programming discrepancies and variations that arise when programming is done by different programmers.
With Saki Self-Programming, one program can be used for all your inspection systems-SPI, pre-reflow, and post-reflow. There is no need to program each machine separately. The inspection program can be generated without first preparing a golden printed circuit board. This especially saves time for businesses that are primarily based on New Product Introduction and those with customers requesting high-mix/low-volume production with short delivery time. Furthermore, since the Offline Debug Function allows fine-tuning to be done remotely without stopping the production line, the time for the user to work with the inspection equipment is minimized.
"Until now, the accuracy of the inspection process depended not just on the inspection system itself, but on the skill level, characteristics, abilities, standardization, and procedures followed by the programmer," said Satoshi Otake, general manager, SAKI Americas. "Saki Self-Programming Software eliminates the variables of the programmers and their programming procedures."
"Saki Self-Programming is the first self-programming software in the industry. It not only automates programming, but also the calibration of the machine, diagnostics, maintenance, inspection, data collection, and extensive reporting functions," explained Sakie (Jodie) Akiyama, president and co-founder of Saki Corporation. "True M2M communication can't happen without it. Software drives the communication in machine-to-machine (M2M) communication and is an enabler for the SMART Factory and Industry 4.0. Saki Self-Programming Software is part of Saki's SMART initiative. To really make SMART and M2M work, we need SMART machines, a SMART factory, and a SMART company."
Saki Self-Programming Software improves process quality and control, ensures a defect-free product, and enhances Industry 4.0/M2M communication with the following features:
- There is no longer a need for a Golden or Silver Board to prepare the inspection program. Since the inspection program can be completed without the Golden board, inspection library fine-tuning is enough.An Offline Debug Function allows fine-tuning without stopping the production line.A solder inspection algorithm with unique 2D/3D hybrid technology automatically recognizes the defect type and distinguishes it from other solder defects.Optical Character Verification shows thumbnails of the components.An Inspection Preset quickly and easily skips between different processes.Self-diagnostics and self-alignment with both time-based and condition-based maintenance. This ensures consistent machine performance and maintains absolute accuracy.A calibration status report enables the system to output calibration results.
See Saki at SMTA International in the Fuji America Booth 407.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
For more information click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.