Bob Neves of Microtek Laboratories China to Speak at IPC High Reliability Conference
August 17, 2018 | Microtek Laboratories ChinaEstimated reading time: 1 minute
Microtek Laboratories China's Bob Neves, chairman and CTO, will present a technical seminar entitled “Testing the Reliability of Automotive & Transportation PCBs” at the IPC Southeast Asia High Reliability Conferences. The conferences will be conducted at the Eastin Grand Hotel on the 29th of August in Ho Chi Minh City, Vietnam and again at the Grand Fourwings Convention Hotel in Bangkok on the 31st of August. The High Reliability Conferences at each location are free of charge.
Microtek is a world leader in testing CCL base materials, PCBs and PCBAs for the automotive supply chain. Microtek’s commitment to automotive and transportation testing includes the use of 10 thermal shock chambers equipped for “Single Hole” or “Daisy Chain” reliability testing along with 28 humidity and HAST chambers, each equipped with 256 channels of CAF/ECM/SIR testing capability up to 2000VDC.
In addition, Microtek has installed a 13-zone, active-cooled, Heller reflow oven at its Changzhou, China facility to accomplish reflow preconditioning for test samples. The new reflow oven is also equipped to use an inert nitrogen environment for reflow that protects the soldermask and surface finish from degradation due to oxidation during reflow exposure.
About Microtek Laboratories China
Microtek Laboratories China is a leading third-party testing agency, serving the electronics and polymeric materials manufacturing industry world-wide. It is operated in accordance with the ISO/IEC17025: 2005 management system, accredited by CNAS, CMA, and many large OEMs. The lab provides testing and conformance verification to company, national & international standards for automotive, telecommunication, aerospace & aviation, electronic information products, polymeric products and other related industries and suppliers. It is a CQC licensed lab for "Non-metal materials" including printed circuit boards (PCB), copper-clad laminates (CCL) and plastics. The lab is also designated as the product service center for CPCA, an authorized training center for IPC-6012, IPC-A-610 & IPC-A-600, as well as a IPC Validation Services Qualified Test Laboratory for IPC-6012 and IPC-4101. In addition, Microtek Laboratories China has the capability of temperature and humidity calibration as recognized by CNAS.
For further information about Microtek Laboratories China, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.