Printed Solar Cell Set to Transform Electronics Manufacturing
September 21, 2018 | CORDISEstimated reading time: 2 minutes
The emerging field of organic electronics is already altering the way we use technology. From light emitting diode displays used in televisions, computers and mobile phones, to panels that convert sunlight into electricity, research institutes and companies are increasingly focusing on the potential of these applications. Enter SmartLine and CORNET, the EU-funded projects tackling the issue of manufacturing in this sector.
As explained in an Organic Electronic Technologies (OET) press release, a research and development team supported by SmartLine has reported an efficiency of 7.4 % for a “fully roll-to-roll (R2R) printed polymer-based single junction organic photovoltaic (OPV) cell.” The team of ΟΕΤ, one of the partners in SmartLine, hopes to achieve 9% efficiency in OPV cells by 2021. Quoted in the same press release, the company’s CEO says the “new result supports efforts for OPV panels mass production [of] up to 1.000.000 m2 annually, targeting various pilot demonstration projects in 2021.”
Flexibility and Cost Efficiency
Although OPVs aren’t currently as efficient at generating electricity as silicon-based solar cells, their performance has improved in recent years. The fact that they can be made rapidly on thin plastic sheets using established printing processes makes them attractive due to reduced manufacturing costs. It’s also possible to stick them to virtually any surface or object for a ready-made source of power. Therefore, the implementation of OPVs could be expanded into existing and new consumer products in a wide range of areas. These include “Energy, Lighting, Displays and Surfaces, Electronic Circuits, all (Bio) Sensors, Wearables, ICT [and] IoT,” according to the press release. However, the market acceptance of organic/large area electronics (OLAEs) is delayed due to several challenges, as summarized on the SmartLine project website.
Some of these problems include insufficient control of the properties of materials and devices, low process yield, limited reliability and high consumption of resources, increased waste and high costs. To address these issues, SmartLine will provide practical industry solutions to achieve an improvement in OLAE devices production. The project website explains: “It will develop sophisticated non-destructive and robust in-line metrology and control solutions for R2R printing and OVPD [organic vapour phase deposition] processes for traceable measurement of properties and quality of highly integrated nano-layers and devices during their fabrication.”
SmartLine (smart in-line metrology and control for boosting the yield and quality of high-volume manufacturing of organic electronics) will digitise and transform the manufacturing processes also in other industries such as thin films (e.g. functional films, antimicrobial and decoration coatings, barriers), automotive, transport, space and health.
Pooling Resources
Thanks to their promising future, OLAEs’ optimization is also addressed by CORNET (multiscale modelling and characterization to optimize the manufacturing processes of organic electronics materials and devices). It aims to develop a “unique EU Open Innovation Environment (OIE) covering the triangle of Manufacturing, Modelling and Experimentation,” according to the CORNET project website. To achieve this, the project will develop a sustainable OIE platform and OIE database.
CORNET will link nanostructure features with macroscopic functionality through multiscale (nano to macro) characterisation and modelling. As a result, it will be possible to produce tailored OLAE devices and systems for demonstration in industrial applications such as automotive and greenhouses.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.