Alpha and MacDermid Enthone to Co-Exhibit at SMTAI
September 25, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions will co-exhibit at the 2018 SMTA International Expo being held October 14-18 at the Donald Stephens Convention Center in Rosemont, Illinois.
At the expo Alpha will feature its latest low temperature solder and void reduction solutions, while MacDermid will feature its full breadth of products for the PCB manufacturing process. Throughout the week, experts from both companies will be presenting over nine papers and chairing several conference sessions. Lenora Clark, director of OEM, MacDermid Enthone, will be one of the presenters at the Women’s Leadership Program, an effort that both companies support and endorse. They will also promote their new slogan, “Connected By Design.” The synergy of the two companies allows for expanded global resources in R&D, production, innovative products and solutions, and best-in-class technical support to electronics manufacturers across all industries.
“’Connected by Design’” is the concept we use to communicate to customers the powerful partnership of Alpha and MacDermid,” said Robert Wallace, Alpha marketing manager of the Americas. “The companies each have their areas of expertise and leadership, and when combined, customers gain access to the leading research and products for plating chemistries and soldering materials that support multiple applications for electronics assemblers.”
Visit Booth 1115 to learn more about the innovative products, solutions and services offered by Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is a global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
For more information, click here.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us here.
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.