Mini LED Backlighting—Expect a High Possibility of Mass Production in 2019
October 29, 2018 | TrendForceEstimated reading time: 2 minutes
Beam angle and thickness of display units jointly decide the number of Mini LED used
According to Julian Lee, the Assistant Research Manager of WitsView, the number of Mini LED used in a display unit is decided by the thickness of the display and the luminance of the backlight unit. On one hand, the optical distance in the backlight unit is bound to be reduced to meet the market demand for thinner consumer electronic devices. On the other hand, the number of Mini LED needed for a single product remains high in order to maintain the high standard of optical performance. With decreasing the number of Mini LED used to be a possible way of cost reduction while keeping the products thinner, the manufactures may turn to increase beam angle as a solution. Current beam angle of Mini LED is around 120 to 140 degrees, and the epitaxy manufactures have been working on increasing the angle to 140~160 degrees.
OLED remains the major rival to Mini LED backlighting
WitsView notes that Mini LED backlighting is still based on the traditional structure of LCD panels, aiming to enhance the luminance and HDR by increasing the number of LED used, while making the performance comparable to that of OLED displays. Taking a 65-inch UHD 4K TV panel as an example, the production cost of panel modules using high-end direct type LED backlight and quantum-dot enhancement film (QDEF) is probably US$600. As for the same size UHD with Mini LED backlight, which uses 16,000 LEDs, the production cost is around US$700. In case of 40,000 LEDs for better performance, the cost will rise to US$1200, 20% higher than an OLED TV of the same size and resolution. Therefore, it will be a key to the wide adoption of Mini LED in the market that how to overcome the technological hurdles while keeping the technology cost effective at the same time.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.