New Tech Delivers High-Tech Film That Blocks Electromagnetic Interference
November 2, 2018 | NYU TandonEstimated reading time: 4 minutes
Electromagnetic interference (EMI), which can harm smartphones, tablets, chips, drones, wearables, and even aircraft and human health, is increasing with the explosive proliferation of devices that generate it. The marketfor EM-blocking solutions, which employ conductive or magnetic materials, is expected to surpass $7 billion by 2022.
André Taylor, associate professor of chemical and biomolecular engineering at the NYU Tandon School of Engineering, along with a team that included Yury Gogotsi, Distinguished University and Charles T. and Ruth M. Bach Professor Materials Science and Engineering at Drexel University, and Menachem Elimelech, Roberto C. Goizueta Professor of Chemical & Environmental Engineering at Yale University used an innovative technique to produce relatively low-cost EMI-blocking composite films.
The study, “Layer-by-Layer Assembly of Cross-Functional Semi-transparent MXene-Carbon Nanotubes Composite Films for Next-Generation Electromagnetic Interference Shielding,” appears in the October 31, 2018 issue of Advanced Functional Materials. Lead authors include Guo-Ming Weng, a post-doctoral fellow at NYU Tandon, and Jinyang Li, associate professor of materials science and engineering at Southwest Jiaotong University, Chengdu, China.
André Taylor, associate professor of chemical and biomolecular engineering and collaborators developed an innovative technique to produce relatively low-cost composite films designed to block electromagnetic interference.
To fashion the films, the team employed spin-spray layer-by-layer processing(SSLbL), a method Taylor pioneeredin 2012. The system employs mounted spray heads above a spin coater that deposit sequential nanometer-thick monolayers of oppositely charged compounds on a component, producing high quality films in much less time than by traditional methods, such as dip coating.
The process allowed them to fashion flexible, semi-transparent EMI-shielding film comprising hundreds of alternating layers of carbon nanotube (CNT), an oppositely charged titanium carbide called MXene—a family of carbide flakes first engineered by Gogotsi—and polyelectrolytes. Taylor explained that those charge characteristics confer benefits beyond EMI shielding.
“As we worked to discern the roles different components play,” he said, “We found that the strong electrostatic and hydrogen bonding between oppositely charged CNT and MXene layers conferred high strength and flexibility.” He added that MXene has the dual benefits of being both adsorbing (it easily adheres to a surface) and conductive, which is important for blocking EMI. “And since the film itself is semi-transparent, it has the benefit of being applicable as EMI shielding for devices with display screens, such as smartphones. Other kinds of shields—metal for example—are opaque. Shielding is good, but shielding that allows visible light through is even better.”
The SSLbL method also confers nanometer-level control over the architecture of the film, allowing manufacturers to change specific qualifies such as conductivity or transparency, because it allows for discrete changes in the composition of each layer. By contrast, films comprising a monolayer mélange of nanoparticles, polyelectrolytes and graphene in a matrix cannot be so modified. Besides high stability, flexibility and semi-transparency, the MXene-CNT composite films also demonstrated high conductivity, a property critical to electromagnetic shielding because it dissipates EM pulses across the film’s surface, weakening and dispersing it.
While manufacturers have shown interest in EMI shielding made of carbon nanotubes and graphene combined with conductive polymer composites, until now a relatively fast, inexpensive, means of creating an optimal mix of these qualities on a thin flexible film was elusive, explained Taylor.
“The primary interest in adding carbon materials to shielding was to add conductive pathways through the film,” said Taylor. “But the SSLbL system is also much faster than traditional dip coating, in which a component to be shielded is repeatedly dipped in a material, rinsed, then dipped again in another layer, and on and on. That takes days. Our system can create hundreds of bi-layers of alternating MXene and CNT in minutes.”
While spin-spraying limits component size, Taylor said that, in theory, the system could create EMI shielding for devices and components equivalent in diameter to the 12-inch wafers, for which spin-coating is frequently employed as a coating mechanism in the semiconductor industry.
“It is less expensive to produce it this way and faster because of the tighter connection between materials, and the LbL process facilitates the controlled arrangement and assembly of disparate nanostructured materials much better than just depositing repeated layers of a mix on several components. One can envision tuning the desired properties of a cross-functional thin film using a wide range of parameters, nanostructured materials and polyelectrolytes using this system.”
About the New York University Tandon School of Engineering
The NYU Tandon School of Engineering dates to 1854, the founding date for both the New York University School of Civil Engineering and Architecture and the Brooklyn Collegiate and Polytechnic Institute (widely known as Brooklyn Poly). A January 2014 merger created a comprehensive school of education and research in engineering and applied sciences, rooted in a tradition of invention and entrepreneurship and dedicated to furthering technology in service to society. In addition to its main location in Brooklyn, NYU Tandon collaborates with other schools within NYU, one of the country’s foremost private research universities, and is closely connected to engineering programs at NYU Abu Dhabi and NYU Shanghai. It operates Future Labs focused on start-up businesses in downtown Manhattan and Brooklyn and an award-winning online graduate program.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.