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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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IDTechEx Highlights World Firsts in Printed Electronics in 2018
November 8, 2018 | PR NewswireEstimated reading time: 5 minutes
Thin Film Electronics (Thinfilm) has set up one of the first printed electronics factories of its kind at its US headquarters in San Jose, California. This 22,000 sq-ft fab is double the size of the development facility it replaced and is home to the world's first production roll-to-roll (R2R) printed electronics line. Replacing a sheet-fed line based on stainless steel substrates, the roll-to-roll line is designed for an annual capacity of up to 7 billion die.
Also in 2018, PragmatIC announced that the first FlexLogIC™ "fab-in-a-box" has now been installed and commissioned in its facility at Sedgefield, UK. FlexLogIC is a self-contained, fully automated system delivering high throughput manufacturing of ultra-low cost, thin and flexible integrated circuits (FlexICs).
Both companies report that equipment cost is orders of magnitude below that of a contemporary silicon fab. Both organizations will be presenting and exhibiting at the IDTechEx Printed Electronics USA event on November 14-15 in Santa Clara, USA.
5. First Application of Structural Electronics using In-Mold technology in Wearables
Suunto, working with TactoTek, have developed Movesense, a wearable system incorporating a connector based on In-Mold Electronics (IME). The IME process ensures 100% weatherproofing and high durability for the component which is typically integrated into apparel, overcoming limitations with some other electronic systems which can quickly degrade when exposed to different weather and wash cycle conditions.
TactoTek will be exhibiting and presenting at the IDTechEx Printed Electronics USA event on November 14-15 in Santa Clara, USA.
6. Printing in the Electronics Industry: New Applications
There have been many new applications of printing in electronics manufacturing. For example, inkjet printing system supplier Notion Systems have installed several systems that are used in the commercial production of PCBs in 2018. Here, the inkjet printers print the solder mask (a green lacquer) which protects the copper surface and prevents solder shorting between components during assembly. The benefit of using inkjet printing is that it provides a uniform coating where needed, potentially saving on lacquer consumption (the lacquer only needs to be printed where needed) and it simplifies the process of applying the solder mask. One customer is moving fully to inkjet printing for an automotive application in 2018 based on the success of the platform. Notion systems will be exhibiting at Printed Electronics USA.
In a completely different example, XTPL are targeting their fine resolution printing system for display repairs. Occasionally small defects arise in the manufacture of LCD or OLED displays. In inspection of the display panels, these are identified. XTPL's process, which enables the printing of conductive lines less than 100nm thick, can be used to repair these defects.
Page 2 of 2Suggested Items
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Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
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Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.