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Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, today reported August 2025 revenue of NT$14,651 million, up 9.13% MoM and down 17.75% YoY. For January through August 2025, cumulative revenue reached NT$106,289 million, up 10.49% YoY, marking a record high for the same period.
According to Zhen Ding, consolidated revenue in August increased MoM but declined YoY, primarily due to customer early pull-ins in the second quarter amid tariff uncertainties. By application, however, revenue from IC Substrates and Server/Automotive/Optical segments-maintained YoY growth in August, with both reaching record highs for the same period. This demonstrates that the company’s strategy in developing diversified high-end applications is beginning to deliver tangible results.
Zhen Ding emphasized that, as indicated during its previous investor conference, customer pull-ins of existing models in the second quarter have moderated the sequential growth of consolidated revenue in the third quarter compared with typical seasonality. Nevertheless, customer inventory buildup for new products in the second half is progressing as planned. Together with sustained order contributions from IC substrates and server/automotive/ optical applications, the company expects second-half performance will surpass the first half. Looking ahead, 2026 will mark a critical year for Zhen Ding to enter its next stage of growth. The company anticipates strong momentum in AI smartphones, foldable phones, and AI glasses, while also securing orders in high-end AI servers and benefiting from rising IC substrate demand. Collectively, these drivers are expected to accelerate revenue growth across all four major application segments.
Zhen Ding will participate in SEMICON Taiwan 2025 from September 10 to 12, showcasing its cutting-edge advanced IC substrate and AI server PCB technologies at Taipei Nangang Exhibition Center, Hall 2, 4F, Zone S (AI Technology Zone). On September 11, General Manager Dr. Jeff Chien will speak at the Smart Manufacturing Forum, delivering a presentation titled “Digital Transformation for PCB Manufacturing to Empower Coevolution in the AI Era.” He will share how Zhen Ding is integrating semiconductor-grade smart manufacturing and digital transformation into PCB production, leveraging advanced technology, superior quality, and high-yield products to capture the tremendous business opportunities driven by AI.
