How Can We Design Electronic Devices That Don’t Overheat?
November 14, 2018 | Stanford UniversityEstimated reading time: 2 minutes

You’ve felt the heat before — the smartphone that warms while running a navigation app or the laptop that gets too hot for your lap.
The heat produced by electronic devices does more than annoy users. Heat-induced voids and cracking can cause chips and circuits to fail.
Now a Stanford-led engineering team has developed a way to not only manage heat, but help route it away from delicate devices. Writing in Nature Communications, the researchers describe a thermal transistor — a nanoscale switch that can conduct heat away from electronic components and insulate them against its damaging effects.
“Developing a practical thermal transistor could be a game changer in how we design electronics,” said senior author Kenneth Goodson, a professor of mechanical engineering.
Researchers have been trying to develop heat switches for years. Previous thermal transistors proved too big, too slow and not sensitive enough for practical use. The challenge has been finding a nanoscale technology that could toggle on and off repeatedly, have a large hot-to-cool switching contrast and no moving parts.
Aided by electrical engineer Eric Pop and materials scientist Yi Cui, Goodson’s team overcame these obstacles by starting with a thin layer of molybdenum disulfide, a semiconducting crystal that is made up of layered sheets of atoms. Just 10 nanometers thick and effective at room temperatures, this material could be integrated into today’s electronics, a critical factor to making the technology practical.
In order to make this heat-conducting semiconductor into a transistor-like switch, the researchers bathed the material in a liquid with lots of lithium ions. When a small electrical current is applied to the system, the lithium atoms begin to infuse into the layers of the crystal, changing its heat-conducting characteristics. As the lithium concentration increases, the thermal transistor switches off. Working with Davide Donadio’s group at the University of California, Davis, the researchers discovered that this happens because the lithium ions push apart the atoms of the crystal. This makes it harder for the heat to get through.
Aditya Sood, a postdoctoral scholar with Goodson and Pop and co-first author on the paper, likened the thermal transistor to the thermostat in a car. When the car is cold, the thermostat is off, preventing coolant from flowing, and the engine retains heat. As the engine warms, the thermostat opens and coolant begins to move to keep the engine at an optimal temperature. The researchers envision that thermal transistors connected to computer chips would switch on and off to help limit the heat damage in sensitive electronic devices.
Besides enabling dynamic heat control, the team’s results provide new insights into what causes lithium ion batteries to fail. As the porous materials in a battery are infused with lithium, they impede the flow of heat and can cause temperatures to shoot up. Thinking about this process is crucial to designing safer batteries.
In a more distant future the researchers imagine that thermal transistors could be arranged in circuits to compute using heat logic, much as semiconductor transistors compute using electricity. But while excited by the potential to control heat at the nanoscale, the researchers say this technology is comparable to where the first electronic transistors were some 70 years ago, when even the inventors couldn’t fully envision what they had made possible.
“For the first time, however, a practical nanoscale thermal transistor is within reach,” Goodson says.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Delta Electronics Posts 26.7% Growth in Sales Revenues for August
09/12/2025 | Delta ElectronicsDelta Electronics, Inc. announced its consolidated sales revenues for August 2025 totaled NT$47,860 million, a 26.7 percent increase as compared to NT$37,770 million for August 2024 and a 5.4 percent increase as compared to NT$45,397 million for July 2025.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.