Putting Food-Safety Detection in the Hands of Consumers
November 15, 2018 | MITEstimated reading time: 5 minutes
The system’s concept derives from a technique called radio frequency spectroscopy, which excites a material with electromagnetic waves over a wide frequency and measures the various interactions to determine the material’s makeup.
But there was one major challenge in adapting this technique for the system: RFID tags only power up at a very tight bandwidth wavering around 950 megahertz. Extracting signals in that limited bandwidth wouldn’t net any useful information.
The researchers built on a sensing technique they developed earlier, called two-frequency excitation, which sends two frequencies — one for activation, and one for sensing — to measure hundreds more frequencies. The reader sends a signal at around 950 megahertz to power the RFID tag. When it activates, the reader sends another frequency that sweeps a range of frequencies from around 400 to 800 megahertz. It detects the feature changes across all these frequencies and feeds them to the reader.
“Given this response, it’s almost as if we have transformed cheap RFIDs into tiny radio frequency spectroscopes,” Adib says.
Because the shape of the container and other environmental aspects can affect the signal, the researchers are currently working on ensuring the system can account for those variables. They are also seeking to expand the system’s capabilities to detect many different contaminants in many different materials.
“We want to generalize to any environment,” Adib says. “That requires us to be very robust, because you want to learn to extract the right signals and to eliminate the impact of the environment from what’s inside the material.”
Page 2 of 2Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.