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Advanced Electronics Packaging Digest

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Suggested Items

Elementary, Mr. Watson: A Nightmare on PCB Street

10/22/2026 | John Watson -- Column: Elementary, Mr. Watson
PCB designers don't need Halloween to know what true terror feels like. This profession has enough built-in “horror” to keep us awake all year long. That probably explains why so many senior PCB designers and engineers eventually fall into one of two categories: gray hair or no hair at all. So, in the spirit of Halloween, let’s imagine a typical street lined with typical houses in an ordinary neighborhood in a quiet town. This is PCB Street. At the very end sits one house that looks like all the others. But it isn't.

The Need for Speed in Mil/Aero Manufacturing

10/20/2026 | Marcy LaRont, I-Connect007 Magazine
Military and aerospace manufacturers are being asked to move faster, whether developing new drone technologies, responding to supply constraints, or getting new designs from prototype to production. James Hofer of Accurate Circuit Engineering sees that pressure as changing more than just manufacturing schedules. He talks about the growing role of quick-turn PCB fabrication, new relationships between defense primes and startups, and why even long-established approaches to standards and manufacturing have to become more adaptable.

Powering the Future: What Engineers Get Wrong About Designing for Reliability

10/07/2026 | Brian Buyea -- Column: Powering the Future
One question I hear more than almost any other is: How do I design electronics for high reliability? It’s a fair question. In industries like aerospace, defense, EV, and industrial power, reliability isn’t a feature; it’s the product. When things fail, they don’t just fail quietly. They fail catastrophically, expensively, and sometimes dangerously. The truth is that most reliability problems are not discovered in testing. They are designed in from the very beginning, and that’s where engineers—good engineers—get it wrong.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skweres -- Column: Flex Connections
In my more than four decades in the industry, I’ve watched design tools and manufacturing capabilities evolve in ways we could hardly have imagined when I started, touching everything from conventional rigid boards to today’s highly sophisticated flexible and rigid-flex circuits. But anyone with meaningful experience in the PCB industry can relate to the phrase, “Just because you can doesn’t mean you should.”
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