Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
MacDermid Enthone to Exhibit and Present at HKPCA
November 21, 2018 | MacDermid Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.
MacDermid Enthone’s circuit board expertise focuses this year on enabling technology trends such as the cost saving and miniaturization of MSAP and high frequency MacDermid Enthone and Alpha experts will be available at booth #6H31 to discuss the latest chemical and material solutions providing process predictability and smooth scale-up at every step.
Show attendees can stop by to obtain more information about the fully expanded MacuSpec acid copper metallization portfolio, and the high performance Systek brand of specialty metallizations for IC substrates including via filling, embedded trace plating, and bump metallization processes. In-depth details about their Modified Semi-Additive Process or MSAP and information on cost effective manufacturing solutions will be available as well.
Experts from the Alpha Assembly Solutions business will be present in the shared booth to talk about low temperature solder alloys, the EV focused silver sintering technology, and the wide range of assembly products offered by the organization.
These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Learn more at booth #6H31.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is a global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.