ELEXCON 2018 Spotlights Smart Electronics of the Future
November 29, 2018 | Shenzhen UBM Creativity Exhibition Co., LtdEstimated reading time: 2 minutes
The moto for Elexcon 2018 is the “Witness True China’s Electronic Innovation". The annual event, held at the Shenzhen Convention and Exhibition Center from December 20 to 22, 2018, will feature cutting edge technologies including AI, 5G, smart home, IoT, smart driving, new energy, and intelligent systems. Elexcon 2018 will feature three technology hubs all aimed at the current industry trends and future technology developments. The Elexcon 2018 technology highlights include:
- Where will advanced passive components lead to?
- How will embedded processors develop?
- How can the industry break through 5G test problems?
Highlight 1: Advanced Passives
This past year, the shortage and price increase of passive components have become a focus in the industry. On the one hand, the rise of automobiles, especially new energy vehicles, drives the consumption of passive components such as capacitors to increase dramatically. The larger profit margin of this market also attracts well-known foreign manufacturers to increase their production capacity. At the same time, the upgrade of smartphones has brought more passive components demand. This requires us to take precautions to grasp the development trend of passive components and understand the planning of leading manufacturers in the industry.
Highlight 2: Embedded processors
After years of deliberation, the Internet of things will finally usher in a big explosion.
According to the definition of the Internet of Things, besides low-power processors, sensors and connections, edge computing has become the focus of attention of the Internet of Things industry and related embedded processor providers. According to Gartner, by 2019 some 14.2 billion interconnected things will be used globally, and by 2021 that number will reach 25 billion. Therefore, how to respond to this change and develop products to meet the needs of relevant suppliers has become the focus of consideration, especially in embedded processors, the competition is particularly fierce. In the face of these new trends, how will embedded processor vendors think and respond?
Highlight 3: Testing and validating 5G
5G attracts the interest of consumers and manufacturers because of its high speed and low latency. 5G represents a significant technology transformation for the industry, and test solutions must cover the entire ecosystem. As a high-frequency communication network, 5G will face a variety of test considerations before it can be applied in practice. This includes testing from R&D, to manufacturing, conformance test, through network deployment, optimization and monitoring.
About Shenzhen UBM Creativity Exhibition Co., Ltd
Shenzhen UBM Creativity Exhibition Co., Ltd. is a Joint venture created by UBM Asia Limited and Creativity Convention & Exhibition (Shenzhen) Co., Ltd. UBM Creativity is a China's leading professional exhibition organization. We have the most powerful exhibition projects and teams, and especially enjoy a high reputation in the field of electronic industry. We are committed to providing services for the rapid development of China's manufacturing industry, through a series of professional exhibition. To create the largest online community in the electronic industry, and to promote a wide range of technical and business networking in the upstream and downstream enterprises of the industry chains. Many of the exhibition projects have become the most trusted communication platform for the professionals in the relevant fields.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.