U.S. Tech Sector Employment Expands by 13,500 Jobs in November
December 7, 2018 | PRNewswireEstimated reading time: 1 minute
The U.S technology sector recorded another strong month for employment growth in November, adding an estimated 13,500 new jobs, according to an analysis by CompTIA, the leading technology industry association.
As has been the case throughout the year, job growth was led by new hiring in IT services, custom software development and computer system design. An estimated 7,600 jobs were added in the category last month.
"Despite the looming economic headwinds, employer demand for tech talent remains steady," said Tim Herbert, senior vice president for research and market intelligence at CompTIA. "The past three months have been the best stretch for technology industry employment gains this year."
The CompTIA report also reveals that November job gains occurred in computer and electronic products manufacturing (+3,200, including +1,400 in semiconductors and electronic components manufacturing); information services, including search portals (+2,700); and data processing, hosting and related services (+1,100).
Employment in the telecommunications category declined by an estimated 1,100 jobs, according to the association's analysis of today's Bureau of Labor Statistics "Employment Situation" report.
Hiring for core technology jobs across the entire economy increased by some 67,000 positions in November.
The November unemployment rate for IT occupations was reported as 2.4%, according to the Bureau of Labor Statistics, down slightly from the 2.5% rate in November 2017. Women and men working in IT occupations have identical unemployment rates of 2.4%.
New job postings for core technology workers was down an estimated 22,626 positions, to 273,980, though the total was still above the 2018 monthly average of 252,000.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.