Raytheon’s Standard Missile-3 Block IIA Destroys Target in First Intercept from Land
December 17, 2018 | Raytheon CompanyEstimated reading time: 1 minute
The Missile Defense Agency completed the third successful intercept of a ballistic missile target by a Raytheon Company SM-3 Block IIA missile, the next-gen variant that defeats missile threats outside the earth's atmosphere. The test evaluated the system's overall performance and achieved three milestones for the IIA variant:
- The first successful intercept from a land-based launch
- The first intercept of an intermediate-range ballistic missile target
- The first intercept using tracking data from remote sensors, known as "engage on remote"
Raytheon's missile defense solutions continue to expand the defended area by protecting against increasingly sophisticated threats with the use of remote sensors. In this test, Raytheon's AN/TPY-2 radar served as a remote sensor, tracking and providing the missile with data on the incoming threat, instead of using the phased-array connected to the Aegis Ashore system.
"This is a versatile and sophisticated missile," said Dr. Taylor W. Lawrence, Raytheon Missile Systems president. "Our partnership with the Missile Defense Agency and Japanese industry made these results possible."
The IIA variant has larger rocket motors and a bigger kinetic warhead, raising its effectiveness against evolving threats. The advanced missile obliterated a medium-range ballistic missile target at sea in October. SM-3 is the only ballistic missile interceptor that can be launched at sea and on land, and has achieved over 30 intercepts in space.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.