Lockheed Martin, Universal Synaptics Corporation Partnering to Solve DoD Intermittent Anomalies
December 17, 2018 | Lockheed MartinEstimated reading time: 1 minute

Lockheed Martin and Universal Synaptics Corporation signed an agreement to help the U.S. Department of Defense (DoD) tackle an issue known as intermittent fault anomaly. A new automated testing technology, developed by Universal Synaptics, called Intermittent Fault Detection discovers random fault anomalies in multi-domain platform electronics as well as wiring harnesses. This issue currently drives an estimated $2 billion in annual DoD maintenance costs.
This system increases platform mission capable rates by eliminating unnecessary follow-on maintenance and proactively addressing emerging issues. This new capability isolates each intermittent fault and provides easy-to-follow maintenance actions for the maintainer to return the unit back into service.
In addition to mission capable improvements, eliminating intermittent failures will dramatically reduce sustainment costs by keeping platforms operating and decreasing repairs and supply support.
“This new capability is groundbreaking, and we’re tremendously excited to help the DoD address a challenge costing them billions,” said Laura Frank, vice president of Lockheed Martin Enterprise Sustainment Solutions. “Resolving intermittence in electronics is a discriminator for the DoD in achieving an 80-percent Mission Capable rate across platforms.”
Together, the team will identify solutions for the DoD with the Intermittent Fault Detection & Isolation System 2.0 (IFDIS2), the Voyager Intermittent Fault Detector (VIFD) and the associated Interface and Application (IA) solutions. This next-generation, integrated system is used to detect intermittent faults in nearly any piece of electronic equipment or wiring on any platform including F-22, F-16, F-35, F/A-18, rotary platforms such as the UH-60 as well as land and sea platforms.
“This partnership aligns our collective goals of reducing No Fault Found and increasing warfighter readiness by eradicating intermittent faults,” said Ken Anderson, Universal Synaptics Corporation president and CEO. “Together we will define a new era of advanced test capabilities and reset test equipment performance expectations for the DoD maintenance enterprise.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
AV Switchblade 600 Loitering Munition System Achieves Pivotal Milestone with First-Ever Air Launch from MQ-9A
09/12/2025 | BUSINESS WIREAeroVironment, Inc. (AV) a global leader in intelligent, multi-domain autonomous systems, announced its Switchblade 600 loitering munition system (LMS) has achieved a significant milestone with its first-ever air launch from an MQ-9A Reaper Unmanned Aircraft System (UAS).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.