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Advanced Electronics Packaging Digest

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Indium Brings Next-Generation Solder Technologies to SMTA Guadalajara 2026

10/02/2026 | Indium Corporation
Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of innovative, high-reliability solder products at the SMTA Guadalajara Expo and Tech Forum, October 7-8, in Guadalajara, Mexico.

Northrop Grumman to Accelerate Extended-Range C-UAS Missile Tech for U.S. Army

09/30/2026 | Northrop Grumman
To address the evolving challenges of detecting and defeating unmanned aerial systems at extended ranges, Northrop Grumman will develop next-generation air-breathing propulsion for the U.S. Army, significantly enhancing the range and air defense capabilities of the Army's eXtended Range Counter-Unmanned Aircraft System (XRC).

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.

U.S. Navy Selects Boeing for F/A-XX Program

09/30/2026 | Boeing
The U.S. Navy announced Boeing has been awarded a multi-billion-dollar contract to produce its F/A-XX aircraft.

General Dynamics Lands $184M Navy Electronic Warfare Contract

09/29/2026 | General Dynamics
General Dynamics Mission Systems has received a $184.25 million U.S. Navy contract for full-rate production of the Next Generation Electronic Attack Unit (NGEAU), which will support the EA-18G Growler electronic warfare aircraft. The system uses an open mission systems processor architecture designed to provide advanced electronic attack capabilities while allowing the Navy to incorporate technology upgrades over the life of the platform.
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