Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
Lockheed Martin, Universal Synaptics Corporation Partnering to Solve DoD Intermittent Anomalies
December 17, 2018 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin and Universal Synaptics Corporation signed an agreement to help the U.S. Department of Defense (DoD) tackle an issue known as intermittent fault anomaly. A new automated testing technology, developed by Universal Synaptics, called Intermittent Fault Detection discovers random fault anomalies in multi-domain platform electronics as well as wiring harnesses. This issue currently drives an estimated $2 billion in annual DoD maintenance costs.
This system increases platform mission capable rates by eliminating unnecessary follow-on maintenance and proactively addressing emerging issues. This new capability isolates each intermittent fault and provides easy-to-follow maintenance actions for the maintainer to return the unit back into service.
In addition to mission capable improvements, eliminating intermittent failures will dramatically reduce sustainment costs by keeping platforms operating and decreasing repairs and supply support.
“This new capability is groundbreaking, and we’re tremendously excited to help the DoD address a challenge costing them billions,” said Laura Frank, vice president of Lockheed Martin Enterprise Sustainment Solutions. “Resolving intermittence in electronics is a discriminator for the DoD in achieving an 80-percent Mission Capable rate across platforms.”
Together, the team will identify solutions for the DoD with the Intermittent Fault Detection & Isolation System 2.0 (IFDIS2), the Voyager Intermittent Fault Detector (VIFD) and the associated Interface and Application (IA) solutions. This next-generation, integrated system is used to detect intermittent faults in nearly any piece of electronic equipment or wiring on any platform including F-22, F-16, F-35, F/A-18, rotary platforms such as the UH-60 as well as land and sea platforms.
“This partnership aligns our collective goals of reducing No Fault Found and increasing warfighter readiness by eradicating intermittent faults,” said Ken Anderson, Universal Synaptics Corporation president and CEO. “Together we will define a new era of advanced test capabilities and reset test equipment performance expectations for the DoD maintenance enterprise.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).