An Interferometric Point-Of-Care Device for Fast and Sensitive Bacteria Quantification
December 27, 2018 | ICN2Estimated reading time: 2 minutes

ICN2 researchers published in ACS Sensors an affordable method for bacteria detection useful for hospital on-site testing and as a clinical point-of-care (PoC) device. Real patient samples were analysed in a hospital setting using a simple one-step process with sample-to-data turnaround time of 40 min. The work was developed within the H2020 European project RAIS.
Conditions such as sepsis, where the survival chances might decrease by 7–8% for every hour that the infection remains untreated, require fast and accurate diagnosis. Outpatients or post-operative patients suspected of bacterial infections also need rapid diagnosis and categorization. Unfortunately, available diagnostic technologies offer slow turnaround times and low sensitivity making an optimal personalized therapy difficult to design. There is a clinical demand for a rapid, sensitive, direct, and affordable method for bacteria detection useful for hospital on-site testing and as a clinical point-of-care (PoC) device.
The Nanobiosensors and Bioanalytical Applications Group, led by Prof. Laura M. Lechuga from the ICN2 (a center of BIST and CSIC) and CIBER-BBN, has recently published a work in ACS Sensors tackling this need in collaboration with ICFO, EPFL (Switzerland) and Hospital Universitari Vall d’Hebrón. Within the framework of the H2020 European project RAIS the researchers have developed an integrated portable and stand-alone instrument based on optical interferometry which, when employed with specialized nanoplasmonics, can directly detect bacterial cells from patient blood plasma.
The researchers evaluated the clinical utility of the biosensor platform using patient blood plasma samples from the Sepsis Bank located at Hospital Universitari Vall d’Hebron. Real patient samples were analysed in the hospitals setting using a simple one-step process with sample-to-data turnaround time of 40 min. The combination of customized microarrays bioprinted onto high performance gold nanohole substrates, combined with an in-house built sophisticated and portable Lens-free Interferometric Microscopy (LIM) device, proved to be a fast and sensitive E. coli quantification method requiring minimal blood plasma volume.
A high sensitivity of 1 bacterial cell has been achieved both in buffer and diluted plasma conditions. The assay involved a direct label-free quantification of E. Coli without sample preprocessing and/or use of secondary antibodies or labels, providing quantification in a simple one-step process. The test could thus be carried out by nonexpert personnel at the bedside of patients and have a strong impact in guiding quick medical decisions across various clinical scenarios. The approach presented in this work paves the way for modern implementable Point of Care diagnostics in the clinical settings for pathogen detection.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
The Chemical Connection: Experience and Wisdom Gained by Doing Business
09/03/2025 | Don Ball -- Column: The Chemical ConnectionA well-managed company learns to adjust its strategies and processes based on what it learns during challenging times. The experience gained from making (or losing) a difficult sale is invaluable in adapting new sales and manufacturing processes necessary to make that sale the next time, no matter how painful those new processes might be.