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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Nomenil Aims to Make Additive Manufacturing Production-Ready

07/09/2026 | Marcy LaRont, I-Connect007
Can additive manufacturing finally move beyond niche applications and into mainstream PCB production? Nomenil founders Bas Le Grand and Dr. Luca Gautero believe the answer lies not in the hardware, but in the software. Drawing on years of inkjet experience, they're developing tools designed to make additive manufacturing more predictable, scalable, and accessible for manufacturers.

MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production Scale

06/04/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies.

Boston Micro Fabrication Introduces BMF Clear, Enabling Scalable Optical Microfabrication

04/07/2026 | Boston Micro Fabrication
Boston Micro Fabrication (BMF), the global leader in micro-precision 3D printing, announces the launch of the BMF Clear, an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.

Transition Automation Introduces Innovative Advancements to Maximize Squeegee Quality and Durability

03/12/2026 | Transition Automation (TA)
Transition Automation, Inc., the leading provider of high-performance metal squeegee blades and holder systems, is announcing two new product advancements designed to improve SMT printing performance and extend squeegee life: Laser-Enhanced Permalex Bonding and Integrated Edge Protectors.

Printing Electronic Parts for Next-Generation Technologies at Argonne

03/13/2026 | BUSINESS WIRE
Tiny electronic devices, called microelectronics, may one day be printed as easily as words on a page, thanks to new research from scientists at the U.S. Department of Energy’s (DOE) Argonne National Laboratory.
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