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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Keiron Printing Technologies Raises €20.7M to Revolutionize LiFT Precision Solder Paste Printing for High-Reliability Electronics

07/22/2026 | Keiron Printing Technologies
Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.

Würth Elektronik Launches Bio-Based PCB Research

07/13/2026 | Wurth Elektronik
With the launch of the collaborative project “Cellutronik” in November 2025, funded by the German Federal Ministry of Research, Technology and Space (BMFTR), Würth Elektronik Circuit Board Technology is setting another milestone toward sustainable electronics solutions.

Nomenil Aims to Make Additive Manufacturing Production-Ready

07/09/2026 | Marcy LaRont, I-Connect007
Can additive manufacturing finally move beyond niche applications and into mainstream PCB production? Nomenil founders Bas Le Grand and Dr. Luca Gautero believe the answer lies not in the hardware, but in the software. Drawing on years of inkjet experience, they're developing tools designed to make additive manufacturing more predictable, scalable, and accessible for manufacturers.

MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production Scale

06/04/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies.

Boston Micro Fabrication Introduces BMF Clear, Enabling Scalable Optical Microfabrication

04/07/2026 | Boston Micro Fabrication
Boston Micro Fabrication (BMF), the global leader in micro-precision 3D printing, announces the launch of the BMF Clear, an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.
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