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Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.

New TSN-MACsec IP Core for Secure Data Transmission in 5G/6G Communication Networks

04/15/2025 | Fraunhofer
Reliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core.

AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum

04/11/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.

NASA’s Advancements in Space Continue Generating Products on Earth

02/14/2025 | NASA JPL
NASA’s Jet Propulsion Laboratory developed or collaborated on multiple technologies highlighted in the agency’s annual publication focused on commercial infusions.

Lockheed Martin to Modernize Air Force F-22 Raptor with Advanced Infrared Threat-Detection Sensors

01/22/2025 | Lockheed Martin
Lockheed Martin has received a $270 million contract from the U.S. Air Force to integrate a system of next-generation infrared defensive sensors on the F-22 Raptor. 
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