Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
BAE Systems RAD750 Single Board Computers Guide InSight Mars Landing
January 10, 2019 | BAE SystemsEstimated reading time: 1 minute
On November 26, 2018, NASA landed its InSight spacecraft on Mars after a six month journey to the Red Planet. InSight, which stands for Interior Exploration using Seismic Investigations, Geodesy and Heat Transport made the trip equipped with BAE Systems RAD750 Single Board Computers (SBC) on board. The lander was built by Lockheed Martin in collaboration with NASA’s Jet Propulsion Laboratory.
“Our SBCs commanded a series of critical maneuvers during the six and a half minute entry, descent and landing phase for InSight,” said Jim LaRosa, director of Space Processor and Products. “This mission will bring new understanding of Mars to NASA scientists, and our radiation hardened computers are integral to its success.”
The RAD750 and BAE Systems’ entire suite of SBCs provide next-generation spacecraft with the high-performance onboard processing capability needed to support space missions like InSight— from weather and planetary exploration to communications, surveillance, and national security missions. This is the eighth Mars mission enabled by BAE Systems’ family of advanced high-reliability radiation-hardened electronics.
In addition to the proven RAD750, the company’s latest SBC, RAD5545, delivers exponential improvements in size, speed, and power-efficiency over its predecessors. The SpaceVPX RAD5545 is powered by the radiation hardened general purpose System-on-Chip processor, featuring DDR3 SDRAM, Flash memory, Serial RapidIO®, Spacewire, and General Purpose IO interfaces, with a fully supported expansion port for a custom interface card. Early deliveries will include a VxWorks 7 Board Support Package with Green Hills INTEGRITY and Linux as future options.
BAE Systems also offers a suite of radiation hardened Serial RapidIO network products, including the RADNET 1848-PS, an 18-Port RapidIO Packet Switch, the RADNET 1616-XP Crosspoint, a protocol agnostic SerDes signal circuit switch and replicator, and the RADNET SRIO-EP, a Serial RapidIO endpoint. These networking devices complement the RAD5545 SBC and allow the user to efficiently manage and route data through the system.
Radiation Hardened Computers are produced at BAE Systems’ facility in Manassas, Virginia. The facility is a U.S. Department of Defense Category 1A Microelectronics Trusted Source. BAE Systems’ radiation-hardened electronics have been on board satellites and spacecraft for almost 30 years, delivering long-lasting computing power in extreme environments. The company has provided more than 900 computers from more than 300 satellites, and has provided the computers that power key national space assets such as Juno and InSight.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Technica USA Partners with Creative Electron
10/22/2025 | Technica USATechnica USA is proud to announce the partnership with Creative Electron Inc. located in San Marcos, CA.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).