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Advanced Electronics Packaging Digest

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GlobalFoundries, Monolithic Power Systems Form Power Solutions Partnership

09/10/2026 | Globe Newswire
GlobalFoundries (GF) and Monolithic Power Systems, Inc. (MPS), a leading company in high-performance power solutions, announced a long-term manufacturing agreement that will deploy MPS’s proprietary process technology to GF’s advanced 300mm manufacturing facility in Singapore.

Who Really Designs the PCB?

09/10/2026 | Stephen V. Chavez, Siemens EDA and PCEA
“Who designs the PCB?” sounds like a simple question, but it assumes there’s a simple answer. In reality, every discipline involved in product development, from electrical and mechanical engineering to manufacturing and procurement, has a hand in designing the PCB. Today’s products are created through constant collaboration among multiple engineering disciplines, each influencing decisions that affect performance, manufacturability, cost, and reliability. The PCB designer has not simply gained access to better tools, more automation, and/or sophisticated design methodologies.

MKS to Showcase Electronics Manufacturing and Precision Laser Solutions at electronica India 2026

09/08/2026 | MKS Inc.
MKS Inc. will showcase their latest innovations for electronics manufacturing at electronica India 2026, taking place September 16–18 at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India.

proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

09/04/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of proteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.
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