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EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.

Arteris Revolutionizes Semiconductor Design with FlexGen

02/19/2025 | Globe Newswire
Arteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.

RTX's Raytheon Completes 10 Subsystem Demonstrations for U.S. Army's Next-Generation Short-Range Interceptor Program

02/18/2025 | RTX
Raytheon, an RTX business, announced a series of 10 successful subsystem demonstrations for the U.S. Army's Next-Generation Short-Range Interceptor (NGSRI), which will eventually replace the Stinger® surface-to-air missile.

DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference

02/13/2025 | DuPont
DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will showcase its latest innovations through technical presentations focused on the development of photoresists for extreme ultraviolet (EUV) lithography and advancing sustainability in the design of lithographic materials.

MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics

02/06/2025 | MacDermid Alpha Electronics Solutions
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.
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