Rogers Launches Next Generation Laminates for Automotive Radar Sensor Applications
January 16, 2019 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation announced the latest addition to its RO3000 Series PTFE circuit materials: RO3003G2 high-frequency laminates.RO3003G2 laminates build on Rogers’ industry leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.
The combination of our optimized resin and filler content along with the introduction of very low profile ED copper translates to Dk of 3.00 @ 10 GHz (clamped stripline method) & 3.07 @ 77 GHz (microstrip differential phase length method). RO3003G2 laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
RO3003G2 laminates are an extension of RO3003 laminates that incorporate Rogers’ decades-long experience working with our automotive radar customers and understanding the increasing product performance requirements.
RO3003G2 laminates:
- Reduce insertion loss via a new very low profile electrodeposited copper (VLP ED).
- Reduce dielectric constant variation through PCB processing as a result of a homogeneous construction and incorporating VLP ED foil.
- Enable designs with denser/smaller diameter micro vias, achieved by an advanced filler system using small rounded particles.
Rogers RO3003G2 high frequency PTFE laminates are available in standard panel sizes of 24 × 18 in. (610 × 457 mm), and 24 × 21 in. (610 × 533.75 mm) with 0.5 oz. (18 µm) or 1.0 oz. (35 µm) ED Cu foil and rolled Cu foil. Available in dielectric thicknesses of 0.005 and 0.010 inch.
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Suggested Items
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.