Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Rogers to Exhibit Latest Material Solutions at IPC APEX EXPO 2019
January 23, 2019 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be exhibiting at the IPC APEX EXPO 2019, January 29 through January 31, at the San Diego Convention Center in San Diego, California. The IPC APEX EXPO is the leading event for the printed circuit board and electronics manufacturing and assembly industry, providing a full technical conference along with the exhibitor expo.
Rogers Corp. (booth #117) will be exhibiting a wide array of its high-performance circuit materials, including thin RO4000 materials for use in advanced millimeter wave multi-layer designs, high impedance laminates for antennas, and a newly introduced laminate for use in radar sensors. It will also contribute to the technical conference with a presentation on January 29 by John Coonrod, technical marketing manager.
New Laminate for Radar Sensors
Rogers will showcase its recently launched RO3003G2laminate for use in radar sensor designs. RO3003G2 laminates build on Rogers’ industry leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.
The combination of optimized resin and filler content along with the introduction of Very Low Profile ED copper translates to a Dk of 3.00 @ 10 GHz (clamped stripline method) & 3.07 @ 77 GHz (microstrip differential phase length method).
These laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
RO4000 Products for Multi-Layer Structures:
RO4000 Thin Materials are next generation products designed to meet the existing and emerging needs of advanced millimeter wave multi-layer designs.
RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T Bonding Materials are 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes.
These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bondply have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
Lastly, CU4000 and CU4000 LoPro Foilsare sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.
Page 1 of 2
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.