Laser-Fabricated Crystals in Glass are Ferroelectric
January 30, 2019 | Lehigh UniversityEstimated reading time: 2 minutes

A team of researchers from Lehigh University, Oak Ridge National Laboratory, Lebanon Valley College and Corning Inc. has demonstrated, for the first time that crystals manufactured by lasers within a glass matrix maintain full ferroelectric functionality.
“This includes the ability to uniformly orient and reverse orient the ferroelectric domains with an electric field―despite the fact that the crystal is strongly confined by the surrounding glass,” says Volkmar Dierolf, chair of Lehigh University’s Department of Physics and one of the scientists who worked on the experiments that resulted in these findings.
Dierolf, who holds a joint appointment with Lehigh’s Department of Materials Science and Engineering part of the P.C. Rossin College of Engineering and Applied Science, is co-Principal Investigator on a National Science Foundation (NSF)-funded project, Crystal in Glass, along with Principal Investigator Himanshu Jain, Diamond Distinguished Chair of Lehigh’s Department of Materials Science and Engineering. The group has become a world leader in producing single crystals in glass by localized laser irradiation. Read more about their work: “Crossing a critical threshold” and “Lehigh scientists fabricate a new class of crystalline solid.”
The team conducted the first detailed examination of the piezoelectric and ferroelectric properties of laser induced crystals confined in glass. They found that the as-grown crystals possess a complex ferroelectric domain structure that can be manipulated via the application of a DC bias. The findings have been published online in MRS Communications in a paper called “Ferroelectric domain engineering of lithium niobate single crystal confined in glass.”
“The findings open up the possibility of a new collection of optical devices that use fully functional laser-fabricated crystals in glass which rely on the precise control of the ferroelectric domain structure of the crystal,” said Keith Veenhuizen, currently Assistant Professor, Department of Physics at Lebanon Valley College and the lead author of the paper, which builds on the work he did as a graduate student at Lehigh.
Applications for such technology include use in modern fiber optic technology used for data transmission.
“Being able to embed such functional single crystal architectures within a glass enables high efficiency coupling to existing glass fiber networks,” says Dierolf. “Such low loss links―that maximize performance―are of particular importance for future quantum information transfer system that are projected to take over the current schemes for optical communication,” adds Dierolf.
In addition to Dierolf, Jain and Veenhuizen, the paper’s co-authors are: Sean McAnany, Department of Materials Science and Engineering, Lehigh University; Rama Vasudevan, Stephen Jesse and Sergei V. Kalinin, Center for Nanophase Materials Sciences, Oak Ridge National Laboratory; and, Daniel Nolan and Bruce Aitken, Corning Incorporated.
Financial support for this research is provided by the National Science Foundation via the GOALI program for collaboration between Lehigh University and Corning Incorporated (DMR-1508177).
By: Lori Friedman
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.