3D Metrology Market Expected to Reach $16.2 Billion by 2024
February 8, 2019 | PRNewswireEstimated reading time: 2 minutes
The 3D metrology market was valued at $9.5 billion in 2018 and is expected to reach $16.2 billion by 2024, at a CAGR of 9.3% from 2018 to 2024. The major driving factors for the 3D metrology market are the highly accurate inspection owing to 3D data for modelling and analysis, focus on quality control, and increase in R&D spending. However, lack of expertise to efficiently handle 3D metrology systems and high cost incurred for setting up the 3D metrology facility are expected to limit the growth of this market.
Hardware Segment to Hold Largest Market Share Among Other Offerings in 2018
Increasing adoption of 3D metrology equipment in industries such as aerospace & defense, automotive, architecture and construction, medical, electronics, energy & power, and heavy machinery to maintain product quality is the major driver for the growth of the hardware market.Also, the growing market for CMM drives the growth of hardware offering in the 3D metrology market.
CMM is required in the automotive industry for inspection, measurement, and quality checking of various components. The automotive industry has been increasingly using optical measurement systems and CMMs instead of conventional strain gauges, accelerometers, transducers, and extensometers for improving the safety and comfort level of a vehicle.
3D AOI to Grow at Highest CAGR from 2018 to 2024
3D AOI inspection technology serves as an effective tool for volumetric and co-planarity inspections. It also provides details on height information of lead tips, BGAs, chip components, and reflowed solder fillets, as well as critical dimensional information of any height-sensitive component.
Reverse Engineering Continues to Grow at Significant Rate during Forecast Period
Reverse engineering is used in industries for 3D modelling, reconstruction from the scanned data, and data for digital simulation. Both CMMs and 3D scanners are used for reverse engineering.
However, using 3D scanners is advantageous as the measurement of soft or fragile parts, and detection of a large number of points can be done in a short time. Reverse engineering is used in areas such as turbine blades, car body parts, engine parts, gears, antennas, boat parts, and medical implants.
Aerospace & Defense Industry is Among Major Contributors in 3D Metrology Market
Manufacturing and assembling of an aircraft require a high level of accuracy in which 3D metrology plays a vital role.In the aerospace industry, 3D metrology processes are used for making precision parts such as frames, wings, sub-assemblies, simulators, test beds, and engines.
In 3D metrology, laser trackers and portable arm coordinate measuring machines are used to ensure that the calibration of the equipment meets the quality standards and regulations for critical aerospace and aeronautic components.
North America to Witness Highest Growth during Forecast Period
The large market share is owing to the growing aerospace and automotive industries in North America and the presence of a large number of distributors for metrology equipment.The continuous technological advancements and financial support from the government further propel the growth of this market.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.