Collaboration Sparks Sustainable Electronics Manufacturing Breakthrough
February 14, 2019 | Simon Fraser UniversityEstimated reading time: 2 minutes
Simon Fraser University and Swiss researchers are developing an eco-friendly, 3D printable solution for producing wireless Internet-of-Things (IoT) sensors that can be used and disposed of without contaminating the environment.
Image Caption: SFU Mechatronic Systems Engineering professor Woo Soo Kim is collaborating with Swiss researchers to develop an eco-friendly 3D printable solution for producing wireless Internet-of-Things sensors. The research team is using a wood-derived cellulose material to replace the plastics and polymeric materials currently used in electronics.
SFU professor Woo Soo Kim is leading the research team's discovery involving the use of a wood-derived cellulose material to replace the plastics and polymeric materials currently used in electronics.
Additionally, 3D printing can give flexibility to add or embed functions onto 3D shapes or textiles, creating greater functionality.
“Our eco-friendly 3D printed cellulose sensors can wirelessly transmit data during their life, and then can be disposed without concern of environmental contamination,” says Kim, a professor in the School of Mechatronic Systems Engineering. The SFU research is being carried out at PowerTech Labs in Surrey, which houses several state-of-the-art 3D printers used to advance the research.
“This development will help to advance green electronics. For example, the waste from printed circuit boards is a hazardous source of contamination to the environment. If we are able to change the plastics in PCB to cellulose composite materials, recycling of metal components on the board could be collected in a much easier way.”
Kim’s research program spans two international collaborative projects, including the latest focusing on the eco-friendly cellulose material-based chemical sensors with collaborators from the Swiss Federal Laboratories for Materials Science.
He is also collaborating with a team of South Korean researchers from the Daegu Gyeongbuk Institute of Science and Technology’s (DGIST)’s department of Robotics Engineering, and PROTEM Co Inc, a technology-based company, for the development of printable conductive ink materials.
In this second project, researchers have developed a new breakthrough in the embossing process technology, one that can freely imprint fine circuit patterns on flexible polymer substrate, a necessary component of electronic products.
Embossing technology is applied for the mass imprinting of precise patterns at a low unit cost. However, Kim says it can only imprint circuit patterns that are imprinted beforehand on the pattern stamp, and the entire, costly stamp must be changed to put in different patterns.
The team succeeded in developing a precise location control system that can imprint patterns directly resulting in a new process technology. The result will have widespread implications for use in semiconductor processes, wearable devices and the display industry.
Earlier this year Kim was selected as a Brain Pool Fellow by the National Research Foundation (NRF) of Korea.
An expert in 3D printed electronics who heads SFU’s Additive Manufacturing Laboratory, he spent six months collaborating with researchers at Seoul National University to advance fabrication of thin film transistors using 3D printing technology.
Suggested Items
Forge Nano Secures $40M to Scale U.S. Battery Manufacturing and Commercial Semiconductor Equipment Businesses
05/02/2025 | Forge NanoForge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, announced the successful close of $40 million in new funding.
MICROOLED Announces Partnership with Vortex Optics and Brand New US Headquarters
05/02/2025 | BUSINESS WIREMICROOLED Inc., the leading global supplier of AMOLED displays, is proud to announce their partnership with Vortex Optics to advance the development of high-performance weapon sights for optical sighting systems.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.