-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
New Henkel Loctite Underfill Material Available Now from Ellsworth Adhesives Europe
February 19, 2019 | Ellsworth AdhesivesEstimated reading time: 2 minutes

The newly launched Henkel Loctite ECCOBOND UF 1173 is now available to order from Ellsworth Adhesives Europe, adding to the supplier’s impressive range of specialty chemicals.
This one component, epoxy underfill has been created for the next-generation of high reliability electronics applications. It is designed to provide a uniform and void-free encapsulating underfill, which maximises a device’s temperature cycling capability and dissipates stress away from solder joints and connections.
Loctite ECCOBOND UF 1173 is fast curing and provides essential interconnect protection from shock, drop and vibration. It can be jet or needle dispensed and is fast flowing in and around tight spaces. Furthermore, the innovative encapsulant has a low coefficient of thermal expansion and exhibits high glass transition (Tg) temperature capability of 155°C. Once applied, it boosts mechanical strength and provides robust environmental protection.
Henkel’s new underfill system offers high performance in electronic applications for the aerospace and automotive sectors. The increasing use of fine-pitch array devices such as chip scale packages (CSP) and ball grid arrays (BGA) in these areas mean that interconnect protection is essential for long-term durability and performance. ECCOBOND UF 1173 can withstand the high operating temperatures which exist within smaller, higher-functioning devices whilst maintaining a high level of performance and processing.
Manufactured with health and safety as a key focus, ECCOBOND UF 1173 does not contain any reportable REACH SVCHCs (as of June 2018), and is not CMR classified.
About Ellsworth Adhesives Europe
Ellsworth Adhesives Europe is a distributor of adhesives, specialty chemicals and adhesive dispensing equipment.
From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, we also supply a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers as well as dispensers and dispensing robots.
At Ellsworth Adhesives Europe we recognise that our customers have different needs. We cater to customers who already know the exact products they want and will supply them with a quick and efficient turnaround, yet we also cater for customers requiring a more technical, in depth service.
Whether you are working on a new or existing application and are wondering which solution will benefit your specific end product the most, our expert sales team can help! With our excellent technical knowledge, we can analyse your end product and process requirements and recommend the material and dispensing system that will work best.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.