Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
New Henkel Loctite Underfill Material Available Now from Ellsworth Adhesives Europe
February 19, 2019 | Ellsworth AdhesivesEstimated reading time: 2 minutes
The newly launched Henkel Loctite ECCOBOND UF 1173 is now available to order from Ellsworth Adhesives Europe, adding to the supplier’s impressive range of specialty chemicals.
This one component, epoxy underfill has been created for the next-generation of high reliability electronics applications. It is designed to provide a uniform and void-free encapsulating underfill, which maximises a device’s temperature cycling capability and dissipates stress away from solder joints and connections.
Loctite ECCOBOND UF 1173 is fast curing and provides essential interconnect protection from shock, drop and vibration. It can be jet or needle dispensed and is fast flowing in and around tight spaces. Furthermore, the innovative encapsulant has a low coefficient of thermal expansion and exhibits high glass transition (Tg) temperature capability of 155°C. Once applied, it boosts mechanical strength and provides robust environmental protection.
Henkel’s new underfill system offers high performance in electronic applications for the aerospace and automotive sectors. The increasing use of fine-pitch array devices such as chip scale packages (CSP) and ball grid arrays (BGA) in these areas mean that interconnect protection is essential for long-term durability and performance. ECCOBOND UF 1173 can withstand the high operating temperatures which exist within smaller, higher-functioning devices whilst maintaining a high level of performance and processing.
Manufactured with health and safety as a key focus, ECCOBOND UF 1173 does not contain any reportable REACH SVCHCs (as of June 2018), and is not CMR classified.
About Ellsworth Adhesives Europe
Ellsworth Adhesives Europe is a distributor of adhesives, specialty chemicals and adhesive dispensing equipment.
From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, we also supply a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers as well as dispensers and dispensing robots.
At Ellsworth Adhesives Europe we recognise that our customers have different needs. We cater to customers who already know the exact products they want and will supply them with a quick and efficient turnaround, yet we also cater for customers requiring a more technical, in depth service.
Whether you are working on a new or existing application and are wondering which solution will benefit your specific end product the most, our expert sales team can help! With our excellent technical knowledge, we can analyse your end product and process requirements and recommend the material and dispensing system that will work best.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.