Exploring the Global Landscape of Quantum Technology Research
February 22, 2019 | IOP PublishingEstimated reading time: 1 minute

Leading quantum technology experts from around the world have explored their respective regional and national goals for the future of the field, in a new focus issue of Quantum Science and Technology (QST).
The first five articles in the collection, covering Australia, Japan, the United States, Canada and the European Union, are published today. They are written by the leading researchers involved in each country or region’s initiative.
QST’s Editor-in-Chief, Dr Robert Thew from the University of Geneva, said: “This collection brings together insights from leaders in the field across the globe, including Europe, Canada, Japan, Australia and the US, providing an unprecedented view of the quantum technology landscape around the world.
“During the last couple of decades, the interest, and along with it the financial investment, in quantum technology research has been steadily ramping up. There are a wide range of potential application areas: quantum computing and simulations; quantum communication, and sensing and metrology.
“Nonetheless, this has remained a primarily academic pursuit until the last few years. We have now started to see a shift towards development of products and applications, which is garnering increasing interest from industry. Companies and governments are starting to realise the scale of the impact these technologies may have for modern society.
“The aim of this collection is to provide insight into this global pursuit for quantum technology research breakthroughs and dominance. It also provides a fascinating perspective into how each of these regions have evolved, the decisions behind launching their respective initiatives, and their aspirations for future research and development.”
Written in an accessible style, the articles focus on the country or region’s history of supporting research in quantum technology; why now is the right time to heavily fund this area; and the future outlook on the field and the benefit to their various regions as a consequence of this investment.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.