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Advanced Electronics Packaging Digest

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The Test Connection Inc. to Showcase Electronic Test Solutions at SMTA Guadalajara 2026

09/08/2026 | The Test Connection Inc.
TTCI will exhibit as part of the USM Reps booth 910, connecting with electronics manufacturing professionals from across Mexico and the international electronics industry.

Koh Young Brings Smart AI Solutions and Expanded True 3D Inspection Portfolio to SMTA Guadalajara 2026

09/08/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will bring its Smart AI Solutions and a broad portfolio of advanced inspection technologies to the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara in Guadalajara, Jalisco, Mexico.

KYZEN to Highlight AQUANOX Cleaning Chemistries and Longer Bath Life at SMTA Guadalajara

09/03/2026 | KYZEN
The AQUANOX line of aqueous cleaning chemistries is formulated to remove a variety of challenging solder flux residues, including no-clean fluxes, from an array of electronic assemblies.

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

08/26/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton University’s Innovative Technologies Complex in New York.

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 
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