One Device, Many Frequencies
March 6, 2019 | Argonne National LaboratoryEstimated reading time: 5 minutes
The next step in the research, Lopez said, will be to reproduce the frequency comb phenomenon in higher-frequency resonators and extend the number of “teeth” — or frequencies — that can be generated.
This research is funded, in part, by DOE’s Office of Science.
About Argonne’s Center for Nanoscale Materials
The Center for Nanoscale Materials is one of the five DOE Nanoscale Science Research Centers, premier national user facilities for interdisciplinary research at the nanoscale supported by the DOE Office of Science. Together the NSRCs comprise a suite of complementary facilities that provide researchers with state-of-the-art capabilities to fabricate, process, characterize and model nanoscale materials, and constitute the largest infrastructure investment of the National Nanotechnology Initiative. The NSRCs are located at DOE’s Argonne, Brookhaven, Lawrence Berkeley, Oak Ridge, Sandia and Los Alamos National Laboratories.
About Argonne National Laboratory
Argonne National Laboratory seeks solutions to pressing national problems in science and technology. The nation’s first national laboratory, Argonne conducts leading-edge basic and applied scientific research in virtually every scientific discipline. Argonne researchers work closely with researchers from hundreds of companies, universities, and federal, state and municipal agencies to help them solve their specific problems, advance America’s scientific leadership and prepare the nation for a better future. With employees from more than 60 nations, Argonne is managed by UChicago Argonne, LLC for the U.S. Department of Energy’s Office of Science.
The U.S. Department of Energy’s Office of Science is the single largest supporter of basic research in the physical sciences in the United States and is working to address some of the most pressing challenges of our time. For more information, visit the Office of Science website.
Page 2 of 2
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
New KYOCERA AVX Capacitors for Optical Communications
02/24/2026 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, expanded its selection of 550/560 Series ultra-broadband capacitors to better satisfy surging cross-market demand for high-speed, high-bandwidth optical communication systems.
Selecting the Right Low-Loss Materials for High-Frequency Circuits
01/26/2026 | IDTechExAs communication systems move to higher frequencies (e.g. 5G/6G) and data transfers move to higher rates, minimizing transmission losses and maintaining signal integrity become very important. This is where low-loss materials come in.
Beyond Design: The Fundamental Structure of Spectral Integrity
10/21/2025 | Barry Olney -- Column: Beyond DesignImpedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.
TTM Technologies Expands Ultra Small Radio Frequency Components Offering for Telecom, Test and Measurement, and COTS Mil-Aero Applications
09/22/2025 | Globe NewswireTTM Technologies, Inc continues to innovate in the field of Radio Frequency & Specialty (RF&S) components with the introduction of new ultra small RF crossover and splitter components. Building on TTM’s commitment to meet the evolving demands within the Telecom, Test and Measurement, and Commercial Off-the-Shelf (COTS) Mil-Aero sectors, these latest offerings further enhance our product lineup.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.