Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
BAE Systems Offers Combat-Proven CV90
March 14, 2019 | BAE SystemsEstimated reading time: 1 minute
BAE Systems confirmed it is offering the CV90, a combat-proven Infantry Fighting Vehicle (IFV), to the Commonwealth of Australia in response to the LAND 400 Phase 3 Mounted Close Combat Capability Request for Tender.
The project team will be led by BAE Systems’ Sweden-based combat vehicles business and supported by BAE Systems Australia.
Advanced and highly-versatile, the CV90 uses the latest technology to keep soldiers safe. BAE Systems has continuously developed the CV90 to meet new customer requirements and future operational threats.
A total of 1280 CV90s are in service with seven nations – including four NATO members – and the vehicle is available in 15 variants, designed to deliver the best capability for the Australian Army. CV90s are already operational with militaries in Denmark, Estonia, Finland, Norway, Sweden, Switzerland and the Netherlands. Most recently, BAE Systems successfully completed the latest delivery of 144 CV90s to the Norwegian Army on time in 2018.
“The CV90 has a combat-proven track record, established customer base, and future growth potential that will more than satisfy the Commonwealth’s requirements for years to come,” said Tommy Gustafsson-Rask, vice president and general manager for BAE Systems Hägglunds, the designer and manufacturer of the vehicle. “We look forward to demonstrating the vehicle’s unparalleled capabilities and our breadth of operational experience as the Australian Commonwealth considers the LAND 400 Phase 3 competition.”
“We’re proud to continue our support of the Australian Defence Force with a commitment to the largest land vehicle upgrade in the Army’s history,” said Gabby Costigan, CEO of BAE Systems Australia. “We look forward to working closely with businesses across the country to increase sovereign Australian Industry Capability as important national projects like this develop.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).