Mass Manufacturing of Metasurfaces
March 18, 2019 | A*STAREstimated reading time: 1 minute
The mass production of flat optical devices with sub-wavelength structures could soon be a reality, thanks to a metasurface fabrication technique developed by researchers at A*STAR.
Image Caption: The metasurface's nano-pillar arrays displaying the letters I, M and E in red, green and blue, respectively. (The Optical Society)
Metasurfaces are synthetic, two-dimensional materials covered in tiny individual shapes with sizes and spacings smaller than the wavelengths of visible light. These ‘sub-wavelength’ structures enable scientists to precisely control the propagating shape, or wavefront, of light beams. As such, metasurfaces show promise for many applications from high-resolution imaging and color printing to controlling light polarization. Mass production of metasurfaces, however, has proven challenging, limited by the complexity of realizing such precise patterns.
Now, Ting Hu and his colleagues at A*STAR’s Institute of Microelectronics (IME) have developed a method of building silicon-based metasurfaces by introducing existing techniques from semiconductor fabrication. Their new metasurface design can produce high-resolution red-green-blue (RGB) color displays.
Until now, metasurfaces have mainly been fabricated via electron beam lithography (EBL), which is not applicable to mass production, as Hu explains:
“With EBL, the focused electron beam moves slowly, step by step, across the metasurface substrate. Metasurfaces with millions — possibly billions — of elements require a very long time to be patterned via EBL. We desired a faster and more efficient way of patternation.”
Hu and the team based their technique on ‘immersion lithography’, which has long been used to etch patterns on to electronic components. With multiple exposures, complex patterns can be built up. The researchers used ultraviolet-based (UV) lithography for initial patternation on to silicon substrates, followed by plasma etching to form the designs in small pixel blocks that were assembled into a 12-inch display surface (see image).
“Our UV lithography tool is a scanner, which can pattern a whole 12 inch wafer with designed devices within half an hour,” says Hu. “We designed the physical dimensions of the nano-pillar arrays of the metasurface to accurately display colors, with fantastic results, for example displaying the letters I, M and E in red, green and blue respectively.”
Hu and the team hope to optimize their design and improve the etching process to minimize losses induced by light scattering and defects in the nano-structure arrays. They are also making efforts to realize flat, lightweight ‘meta-lenses’ and dot projectors with potential uses in facial recognition technologies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Smart Eye Collaborates with Sony on Next-Generation Interior Sensing and Iris Authentication
10/09/2025 | Smart EyeSmart Eye AB, the global leader in Interior Sensing AI and Driver Monitoring Systems (DMS), announced a collaboration with Sony Semiconductor Solutions Corporation (Sony) to integrate Smart Eye’s interior sensing and biometric authentication software with Sony’s newly released IMX775 RGB-IR image sensor.
SEMICON Europa 2025 to Highlight Innovations in Advanced Packaging, Fab Management, and MEMS and Imaging Sensors to Bolster Europe’s Semiconductor Resilience
10/03/2025 | SEMISemiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
MEMS & Imaging Sensors Summit to Spotlight Sensing Revolution for Europe’s Leadership
09/11/2025 | SEMIIndustry experts will gather November 19-20 at the SEMI MEMS & Imaging Sensors Summit 2025 to explore the latest breakthroughs in AI-driven MEMS and imaging optimization, AR/VR technologies, and advanced sensor solutions for critical defence applications.
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
09/11/2025 | Globe NewswireAccording to the SNS Insider, “The Direct Imaging System Market size was valued at $2.21 Billion in 2024 and is projected to reach $4.30 Billion by 2032, growing at a CAGR of 8.68% during 2025-2032.”
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.