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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ACB Invests in New Lamination Lines Technology
April 5, 2019 | ACBEstimated reading time: 1 minute

Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that ACB NV (Belgium) has installed successfully two state-of-the-art dry film lamination lines for inner- and outer layers.
“We at ACB are pleased to have chosen Dynachem after extensive evaluation. Both lines have been installed successfully and running well,” commented Jan Van De Putte (responsible engineer) /Wim Van De Moortel (process engineering manager at ACB).
“We are extremely pleased to have been chosen by ACB once again for both innerlayer and outer layer dry film lamination lines. We believe that our SmartLam Model 5200 can satisfy the technology required in the current PCB industry. This laminator model has the flexibility to manage either panel types down to 1-mil core (rigid and flex), using Dynachem unique clamping thin layer support and the automatic dry film tension device, and up to 12.7mm thickness without any special adjustment. Machine can be equipped also with its own wet module when higher dry film adhesion is required. In addition the new HMI software meets the industry 4.0 requirement and it can support also the SECS/GEM protocol mostly used in the semiconductors industry,” said ALT – Dynachem Managing Director Osvaldo Novello.
About ACB
ACB is one of Europe’s leading manufacturer of high technology and quick turnaround printed circuit boards. they offer a wide range of technologies including rigid, flex-rigid and flexible multilayer boards. to learn more about ACB, please visit webpage on www.acb.be
About Automatic Lamination Technologies—Dynachem
ALT – Dyanchem is an independent, privately-held company fully dedicated to design, manufacture and offer high Technology equipment to the PCB, chemical milling, semiconductor and photovoltaic industries.
To learn more about ALT- Dyanchem, please visit webpage on www.dynachem.eu.
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