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MacDermid Alpha to Promote High-Rel Die Attach Solutions at PCIM
April 18, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
The Assembly division of MacDermid Alpha Electronics Solutions will showcase its range of high-reliability die attach solutions, including ALPHA Argomax Silver Sinter Technology, at the PCIM exhibition in Nuremberg, Germany from the May 7-9, 2019.
During the show, Gyan Dutt, Global Portfolio Manager, Die Attach Assembly for MacDermid Alpha, will be presenting on the “Thermal Resistance of Interconnect Layers in Inverter Power Assembly Stacks“ at the PCIM Conference. “The increasing adoption of wide band gap semiconductors, along with the increasing current density within the power modules in traction inverters, has led to the thermal impedance of the stack becoming more important“ comments Gyan. "The paper presentation will look at the role of interconnects in power assembly stacks and how this effects the overall thermal resistance.“
ALPHA Argomax Silver Sinter Technology, which has been specially developed for die attach, package attach and substrate-heat spreader attach in traction inverters and other high voltage applications, provides a dramatic reduction in thermal resistance and inductance.
“The ALPHA Argomax technology creates extremely high thermal and electrical conductivity silver bonds“, explains Julien Joguet, Global Business Market Manager. Die Attach at MacDermid Alpha. “The high thermal conductivity delivered by ALPHA Argomax enables individual die to handle much higher levels of current, reducing the total number of die required, and providing the highest levels of efficiency. ALPHA Argomax also provides an unprecedented increase in die attach reliability, more than 30x higher than traditional solder methods.“
ALPHA Argomax is available in paste, film and preform material types and solutions from Ag, Au and Cu surface finishes for unparalleled flexibility. To speak to one of our technology experts visit MacDermid Alpha in Hall 7 Booth 518 at the PCIM exhibition or visit the Alpha website.
About PCIM
Date: Tuesday 7th – Thursday 9th May
Location: Nuremberg, Germany
PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Exhibitors from across the globe will present the newest products, trends and developments in the power electronics industry. PCIM Europe is the forum for technologies for the whole value chain of the power electronics industry from the components to the intelligent system.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
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