Scaling Forward
April 25, 2019 | Argonne National LaboratoryEstimated reading time: 3 minutes
Argonne scientist’s approach to molecular modeling may accelerate the development of new organic materials for electronics.
Schematic of the ANN-ECG method used in this work. Schematic example shows a three-bead/monomer coarse-grained molecular model mapping for sexi(3-methyl)thiophene.
Organic electronics have the potential to revolutionize technology with their high cost-efficiency and versatility compared with more commonly used inorganic electronics. For example, their flexibility could allow companies to print them like paper or incorporate them into clothing to power wearable electronics. However, they have failed to gain much industry traction due to the difficulty of controlling their electronic structure.
To help address this challenge, Nick Jackson, a Maria Goeppert Mayer Fellow at the U.S. Department of Energy’s (DOE) Argonne National Laboratory, has developed a faster way of creating molecular models by using machine learning. Jackson’s models dramatically accelerate the screening of potential new organic materials for electronics and they could also be useful in other areas of materials science research.
The internal structure of an organic material affects its electrical efficiency. The current manufacturing processes used to produce these materials are sensitive, and the structures are extremely complex. This makes it difficult for scientists to predict the final structure and efficiency of the material based on manufacturing conditions. Jackson uses machine learning, a way of training a computer to learn a pattern without being explicitly programmed, to help make these predictions.
Jackson’s research focuses on vapor deposition as a means to assemble materials for organic electronics. In this process, scientists evaporate an organic molecule and allow it to slowly condense on a surface, producing a film. By manipulating certain deposition conditions, the scientists can finely tune the way the molecules pack in the film.
“It’s kind of like a game of Tetris,” said Jackson. “The molecules can orient themselves in different ways, and our research aims to determine how that structure influences the electronic properties of the material.”
The packing of the molecules in the film affects the material’s charge mobility, a measure of how easily charges can move inside it. The charge mobility plays a role in the efficiency of the material as a device. To study this relationship, and to optimize device performance, Jackson’s team runs extremely detailed computer simulations of the vapor deposition process.
“We have models that simulate the behavior of all of the electrons around each molecule at nanoscopic length and time scales,” said Jackson, “but these models are computationally intensive, and therefore take a very long time to run.”
To simulate the packing of entire devices, often containing millions of molecules, scientists must develop computationally cheaper, coarser models that describe the behavior of electrons in groups of molecules rather than individually. These coarse models can reduce computation time from hours to minutes, but the challenge is in making the coarse models truly predictive of the physical results. Jackson uses his machine learning algorithms to uncover the relationships between the detailed and coarse models.
“I drop my hands and leave it to machine learning to regress the relationship between the coarse description and the resulting electronic properties of my system,” Jackson said.
Using an artificial neural network and a learning process called backpropagation, the machine learning algorithm learns to extrapolate from coarse to more detailed models. Using the complex relationship that it finds between the models, it trains itself to predict the same electronic properties of the material using the coarse model as the detailed model would predict.
“We are developing cheaper models that still reproduce all of the expensive properties,” said Jackson.
The resulting coarse model allows the scientists to screen two to three orders of magnitude more packing arrangements than before. The results of the analysis from the coarse model then help experimentalists to more quickly develop high-performance materials.
Shortly after Jackson began his appointment under University of Chicago professor and Argonne Senior Scientist Juan de Pablo, he had the idea to accelerate his research with machine learning. He then took advantage of the laboratory’s high-performance computing capabilities by collaborating with Venkatram Vishwanath, Data Sciences and Workflows Team Lead with the Argonne Leadership Computing Facility, a DOE Office of Science User Facility.
Materials scientists have used machine learning before to find relationships between molecular structure and device performance, but Jackson’s approach is unique, as it aims to do this by enhancing the interaction between models of different length and time scales.
“In the physics community, researchers try to understand the properties of a system from a coarser perspective and to reduce the number of degrees of freedom to simplify it as much as possible,” said Jackson.
Although the targeted goal of this research is to screen vapor deposited organic electronics, it has potential application in many kinds of polymer research, and even fields such as protein science. “Anything where you are trying to interpolate between a fine and coarse model,” he added.
In addition to its broader applications, Jackson’s advancements will help propel organic electronics towards industrial relevance.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.