Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power Innovation

09/04/2026 | Siemens
Siemens announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives.

MKS Highlights Laser and Chemistry Solutions at KPCA Show 2026

09/03/2026 | Atotech
MKS Inc. will showcase integrated manufacturing solutions in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at KPCA Show 2026 held at Songdo Convensia in Incheon, South Korea, from September 9–11. Visitors can meet MKS’ representatives at booth 201 in hall 3 and discover the company’s latest solutions for advanced electronics manufacturing.

Infineon, Tack One Win SICC Award for Best Technological Collaboration

08/31/2026 | Infineon
Infineon Technologies Asia Pacific Pte Ltd and Tack One Pte Ltd have been recognized by Singapore International Chamber of Commerce (SICC)  as the winner of the “Best Technological Collaboration” category and as a finalist in the “Most Sustainable Collaboration” category at the 2026 SICC Awards ceremony, for their partnership in developing FloodFinder™, a smart urban flood monitoring system.

Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

08/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in