SEMICON West to Feature the Future of Smart Transportation
April 25, 2019 | SEMIEstimated reading time: Less than a minute
The semiconductor industry is on the cusp of a rapid, multi-year expansion powered by new end-markets and growth in revolutionary technology segments. One such market vertical is automotive, which leads all new application spaces for semiconductor growth and has a major impact on boosting demand for adjacencies like FHE and MEMS & sensors.
At SEMICON West, the semiconductor industry’s premier trade event, the Smart Transportation Pavilion will feature many informative sessions on the latest developments, technologies, and future of automotive electronics.
With the theme Beyond Smart, SEMICON West will be held from July 9–11, 2019, at the Moscone Center in San Francisco, California.
For more information, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Ynvisible Expands into South America Through Strategic Collaboration with ED Technologies
10/22/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of printed low-power e-paper display products, is pleased to announce a strategic partnership with ED Technologies to support market development across South America, with an initial focus on Brazil.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.