Impending Surge in E-Packaging and Intelligent Packaging
April 29, 2019 | PRNewswireEstimated reading time: 2 minutes
The IDTechEx Research report "Smart Packaging 2019-2029" covers the upcoming requirements and drivers for smart packaging, feedback from Fast Moving Consumer Goods (FMCG) brands on their views of smart packaging, assessment of enabling technologies, smart packaging case studies, key players and electronic smart packaging forecasts. This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.
IDTechEx analyzes and concludes in this report how the global demand for electronic smart packaging will reach a value of $1.8 billion in 2029 based on the value of the electronics in packaging—more if the infrastructure, software and services are also included. Based on an impartial analysis, IDTechEx expects that almost 39 billion packages sold in 2029 will feature an electronic feature of some sort to enhance the package.
Smart packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face oblivion from counterfeiting to the aging population's need for drug delivery devices.
Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.
There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:
- RFID for wireless item identification (usually invisible to the consumer)
- Electronic Articles Surveillance (EAS) for anti-theft (usually invisible to the consumer)
- QR codes for identification
- Data loggers for temperature, shock, vibration, etc. monitoring
- Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
- Chemical indicators: temperature, frozen chemical visual indicators
- Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
- External active packaging: whereby the package releases aromas, for example, to entice consumers
Drivers for Smart Packaging
There are prominent drivers for smart packaging, including the aging population, more wealthy consumers, requirements for more data on products purchased, entertainment value, the need to distinguish products amidst greater competition and tougher legislation.
Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.
Across that backdrop, there are other significant impending changes, from increasing home delivery of products and groceries to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels.
Global, Detailed Assessment of Smart Packaging
Smart Packaging 2019-2029 covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time with… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
Technica Participates in Arizona SMTA Expo
04/22/2026 | Technica USAAn active supporter of the SMTA organization and the various SMT branch expos, Technica USA was present at this week’s expo in Arizona. Along with Technica’s local Account Manager, Dan Spencer, other supply partners joined Technica for this event.
Dan’s Biz Bookshelf: ‘iWar: Fortnite, Elon Musk, Spotify, WeChat, and Laying Siege to Apple’s Empire’
03/04/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf"iWar: Fortnite, Elon Musk, Spotify, WeChat, and Laying Siege to Apple’s Empire" is not just a book about Apple, it’s a masterclass in leadership, ego, innovation, and the high cost of brilliance when vision collides with personality. Tim Higgins delivers a sharp, deeply reported account of Apple’s most turbulent years, showing how internal power struggles shaped the products that changed the world.
Technica USA and Electro Design AB Form Strategic Partnership
03/02/2026 | Technica USAOn March 2, 2026, Technica USA announced a strategic partnership with Electro Design AB. Under this agreement, Technica will serve as the Master Distributor in the United States and Canada for Electro Design's automation products for the SMT/PCBA market, marketed under the brand name “Technica, U.S.A. by Electro Design.”
The Performance-enhancing Benefits of Flexible Circuit Technology
02/05/2026 | Joe Fjelstad, Verdant ElectronicsFlexible circuits have been around much longer than most folks realize. My friend, Dr. Ken Gilleo, unquestionably a technology forensics genius, unearthed a British patent issued to Albert Hansen of Germany just after the turn of the last century (Figure 1), which we can easily recognize today as an ancestral flexible circuit. We owe his creativity a great deal of credit for laying the foundation for countless electronic products in use today that employ flex circuits.