Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance

04/29/2025 | BUSINESS WIRE
Kasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.

QuantumScape, Murata Announce Framework for Ceramics Collaboration

04/25/2025 | BUSINESS WIRE
QuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QS’s solid-state battery technology.

IPC Welcomes Exemptions to Reciprocal Tariffs

04/14/2025 | IPC
IPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:

ASMPT Demonstrates Technology Leadership in SMT Assembly

04/09/2025 | ASMPT
The rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in